EEWorld首页 新闻 论坛 博客 白皮书 专题 电子电路 电子器件 单片机 嵌入式 模拟电路 DSP FPGA 电源管理 手机/便携 医疗电子 汽车电子 工业控制
厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

BUP304

器件描述:IGBT (Low forward voltage drop High switching speed Low tail current Latch-up free Avalanche rated)
器件厂商:SIEMENS [Siemens Semiconductor Group]
文件大小:378.54KB,共7页
Sponsor by e络盟
器件资料摘要:
Semiconductor Group 1 Jul-30-1996
BUP 304
IGBT
Preliminary data
• Low forward voltage drop
• High switching speed
• Low tail current
• Latch-up free
• Avalanche rated
Pin 1 Pin 2 Pin 3
G C E
Type V
CE
I
C
Package Ordering Code
BUP 304 1000V 35A TO-218 AB Q67078-A4200-A2
Maximum Ratings
Parameter Symbol Values Unit
Collector-emitter voltage V
CE
1000 V
Collector-gate voltage
R
GE
= 20 kΩ
V
CGR
1000
Gate-emitter voltage V
GE
± 20
DC collector current
T
C
= 25 °C
T
C
= 90 °C
I
C
23
35
A
Pulsed collector current, t
p
= 1 ms
T
C
= 25 °C
T
C
= 90 °C
I
Cpuls
46
70
Avalanche energy, single pulse
I
C
= 15 A, V
CC
= 50 V, R
GE
= 25 Ω
L = 200 µH, T
j
= 25 °C
E
AS
23
mJ
Power dissipation
T
C
= 25 °C
P
tot
310
W
Chip or operating temperature T
j
-55 ... + 150 °C
Storage temperature T
stg
-55 ... + 150