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厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

BUK465-60A

器件描述:PowerMOS transistor
器件厂商:PHILIPS [Philips Semiconductors]
文件大小:59.17KB,共7页
Sponsor by e络盟
器件资料摘要:
Philips Semiconductors Product specification
PowerMOS transistor BUK465-60A
GENERAL DESCRIPTION QUICK REFERENCE DATA
N-channel enhancement mode SYMBOL PARAMETER MAX. UNIT
field-effect power transistor in a plastic
envelope suitable for surface mount V
DS
Drain-source voltage -60A
applications. I
D
Drain current (DC) 60 V
The device is intended for use in P
tot
Total power dissipation 41 A
Switched Mode Power Supplies T
j
Junction temperature 125 W
(SMPS), motor control, welding, R
DS(ON)
Drain-source on-state 175 ˚C
DC/DC and AC/DC converters, and in resistance 0.038 Ω
automotive and general purpose
switching applications.
PINNING - SOT404 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 gate
2 drain
3 source
mb drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
Drain-source voltage - - 60 V
V
DGR
Drain-gate voltage R
GS
= 20 kΩ -60
±
GS
Gate-source voltage - - 30 V
I
D
Drain current (DC) T
mb
= 25 ˚C - 41 A
I
D
Drain current (DC) T
mb
= 100 ˚C - 29 A
I
DM
Drain current (pulse peak value) T
mb
= 25 ˚C - 164 A
P
tot
Total power dissipation T
mb
= 25 ˚C - 125 W
T
stg
Storage temperature - - 55 175 ˚C
T
j
Junction temperature - - 175 ˚C
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction to - - 1.2 K/W
mounting base
R
th j-a
Thermal resistance junction to minimum footprint, - 50 - K/W
ambient FR4 boards (see Fig 18).
13
mb
2
d
g
s
February 1996 1 Rev 1.000