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器件描述:MiniPROFET (High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis)
器件厂商:SIEMENS [Siemens Semiconductor Group]
厂商主页:http://www.infineon.com/
文件大小:65.35KB
文件页数:7
PDF阅读:BSP550.pdf (点击阅读器件资料)
摘要:
Mini PROFET ? BSP 550 Semiconductor Group 1 06.96 MiniPROFET ? High-side switch ? Short-circuit protection ? Input protection ? Overtemperature protection with hysteresis ? Overload protection ? Overvoltage protection ? Switching inductive load ? Clamp of negative output voltage with inductive loads ? Undervoltage shutdown ? Maximum current internally limited ? Electrostatic discharge (ESD) protection ? Reverse battery protection 1) Package: SOT 223 Type Ordering code BSP 550 Q67000-S311 Maximum Ratings Parameter Symbol Values Unit Supply voltage range V bb -0.3...48 V Load current self-limited I L I L(SC) A Maximum input voltage 2) V IN -5.0...V bb V Maximum input current I IN ±5 mA Inductive load switch-off energy dissipation single pulse I L = 1.0A , T A = 85°C E AS 0.3 J Operating temperature range Storage temperature range T j T stg -40 ...+125 -55 ...+150 °C Max. power dissipation (DC) 3) T A = 25 °C P tot 1.4 W Electrostatic discharge capability (ESD) 4) V ESD ±1kV Thermal resistance chip - soldering point: chip - ambient 3) R thJS R thJA 7 70 K/W IN3 R in + V bb Signal GND ESD MINI-PROFET OUT GND Logic Voltage sensor Voltage source Charge pump Level shifter Temperature sensor Rectifier Limit for unclamped ind. loads Gate protection Current limit 2 4 1 Load GND Load V Logic Overvoltage protection ESD- Diode 1) With resistor R GND =150 ? in GND connection, resistor in series with IN connections reverse load current limited by connected load. 2) At V IN > V bb , the input current is not allowed to exceed ±5 mA. 3) BSP 550 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm 2 copper area for V bb connection 4) HBM according to MIL-STD 883D, Methode 3015.7 1 2 3 4 Pins 1234 OUT GND IN V bb
相关器件:Q67000-S311
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