1Motorola Small–Signal Transistors, FETs and Diodes Device Data
C0078C0080C0078 C0083C0109C0097C0108C0108C0045C0083C0105C0103C0110C0097C0108
C0068C0097C0114C0108C0105C0110C0103C0116C0111C0110 C0084C0114C0097C0110C0115C0105C0115C0116C0111C0114
This NPN small signal darlington transistor is designed for use in switching
applications, such as print hammer, relay, solenoid and lamp drivers. The device is
housed in the SOT-223 package, which is designed for medium power surface mount
applications.
• The SOT-223 Package can be soldered using wave or reflow. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die
• Available in 12 mm Tape and Reel
Use BSP52T1 to order the 7 inch/1000 unit reel
Use BSP52T3 to order the 13 inch/4000 unit reel
• PNP Complement is BSP62T1
MAXIMUM RATINGS (T
C
= 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector-Emitter Voltage V
CES
80 Vdc
Collector-Base Voltage V
CBO
90 Vdc
Emitter-Base Voltage V
EBO
5.0 Vdc
Collector Current I
C
500 mAdc
Total Power Dissipation @ T
A
= 25°C
(1)
Derate above 25°C
P
D
0.8
6.4
Watts
mW/°C
Operating and Storage Temperature Range T
J
, T
stg
–65 to 150 °C
DEVICE MARKING
AS3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance – Junction-to-Ambient (surface mounted) R
θJA
156 °C/W
Maximum Temperature for Soldering Purposes
Time in Solder Bath
T
L
260
10
°C
Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by BSP52T1/D
C0077C0079C0084C0079C0082C0079C0076C0065
SEMICONDUCTOR TECHNICAL DATA
 Motorola, Inc. 1996
C0066C0083C0080C0053C0050C0084C0049
MEDIUM POWER
NPN SILICON
DARLINGTON
TRANSISTOR
SURFACE MOUNT
Motorola Preferred Device
CASE 318E-04, STYLE 1
TO-261AA
1
2
3
4COLLECTOR 2,4
BASE
1
EMITTER 3
REV 1