BS616UV1010AC
器件描述:Ultra Low Power/Voltage CMOS SRAM 64K X 16 bit
文件大小:216.21KB,共10页
Sponsor by e络盟
器件资料摘要:
Revision 2.2
April 2001
1
R0201-BS616UV1010
POWER DISSIPATION
SPEED
(ns)
STANDBY
(ICCSB1, Max)
Operating
(ICC, Max)
PRODUCT
FAMILY
OPERATING
TEMPERATURE
Vcc
RANGE
Vcc=3.0V Vcc=3.0V Vcc=2.0V Vcc=3.0V Vcc=2.0V
PKG TYPE
BS616UV1010EC TSOP2-44
BS616UV1010AC
+0
O
C to +70
O
C 1.8V ~ 3.6V 150 0.5uA 0.3uA 15mA 10mA
BGA-48-0608
BS616UV1010EI TSOP2-44
BS616UV1010AI
-40
O
C to +85
O
C 1.8V ~ 3.6V 150 1uA 20mA1.5uA 15mA
BGA-48-0608
Ultra Low Power/Voltage CMOS SRAM
64K X 16 bit
• Ultra low operation voltage : 1.8 ~ 3.6V
• Ultra low power consumption :
Vcc = 2.0V C-grade : 10mA (Max.) operating current
I- grade : 15mA (Max.) operating current
0.01uA (Typ.) CMOS standby current
Vcc = 3.0V C-grade : 15mA (Max.) operating current
I- grade : 20mA (Max.) operating current
0.02uA (Typ.) CMOS standby current
• High speed access time :
-15 150ns (Max.) at Vcc = 3.0V
• Input levels are CMOS-compatible
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE and OE options
• I/O Configuration x8/x16 selectable by LB and UB pin
The BS616UV1010 is a high performance, ultra low power CMOS Static
Random Access Memory organized as 65,536 words by 16 bits and
operates from a wide range of 1.8V to 3.6V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current
of 0.01uA and maximum access time of 150ns in 2V operation.
Easy memory expansion is provided by an active LOW chip
enable(CE) and active LOW output enable(OE) and three-state output
drivers.
The BS616UV1010 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS616UV1010 is available in the JEDEC standard 44-pin TSOP
Type II and 48-pin mini-BGA.