BS616LV2025AC
器件描述:Very Low Power/Voltage CMOS SRAM 128K x 16 or 256K x 8 bit switchable
文件大小:253.36KB,共11页
Sponsor by e络盟
器件资料摘要:
Revision 2.4
April 2002
1
Very Low Power/Voltage CMOS SRAM
128K x 16 or 256K x 8 bit switchable
The BS616LV2025 is a high performance, very low power CMOS Static
Random Access Memory organized as 131,072 words by 16 bits or
262,144 bytes by 8 bits selectable by CIO pin and operates from a wide
range of 4.5V to 5.5V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current
of 0.6uA and maximum access time of 70/55 ns in 5V operation.
Easy memory expansion is provided by active HIGH chip
enable2(CE2), active LOW chip enable1(CE1), active LOW output
enable(OE) and three-state output drivers.
The BS616LV2025 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS616LV2025 is available in DICE form and 48-pin BGA type.
POWER DISSIPATION
SPEED
( ns )
STANDBY
( ICCSB1, Max )
Operating
( ICC, Max )
PRODUCT
FAMILY
OPERATING
TEMPERATURE
Vcc
RANGE
Vcc=5.0V Vcc=5.0V Vcc=5.0V
PKG TYPE
BS616LV2025DC DICE
BS616LV2025AC
+0
O
C to +70
O
C 4.5V ~ 5.5V 70 / 55 6uA 40mA
BGA-48-0608
BS616LV2025DI DICE
BS616LV2025AI
-40
O
C to +85
O
C 4.5V ~ 5.5V 70 / 55 25uA 45mA
BGA-48-0608
• Very low operation voltage : 4.5 ~ 5.5V
• Very low power consumption :
Vcc = 5.0V C-grade: 40mA (Max.) operating current
I -grade: 45mA (Max.) operating current
0.6uA (Typ.) CMOS standby current
• High speed access time :
-70 70ns (Max.) at Vcc = 5.0V
-55 55ns (Max.) at Vcc = 5.0V
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE1, CE2 and OE options
• I/O Configuration x8/x16 selectable by CIO, LB and UB pin