BS616LV1010AI
器件描述:Very Low Power/Voltage CMOS SRAM 64K X 16 bit
文件大小:216.4KB,共10页
Sponsor by e络盟
器件资料摘要:
Revision 2.2
April 2001
1
R0201-BS616LV1010
POWER DISSIPATION
SPEED
(ns)
STANDBY
(ICCSB1, Max)
Operating
(ICC, Max)
PRODUCT
FAMILY
OPERATING
TEMPERATURE
Vcc
RANGE
Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V
PKG TYPE
BS616LV1010EC TSOP2-44
BS616LV1010AC
+0
O
C to +70
O
C 2.4V ~ 5.5V 70 3uA 0.5uA 35mA 20mA
BGA-48-0608
BS616LV1010EI TSOP2-44
BS616LV1010AI
-40
O
C to +85
O
C 2.4V ~ 5.5V 70 5uA 1.5uA 40mA 25mA
BGA-48-0608
Very Low Power/Voltage
64K X 16 bit
CMOS SRAM
• Very low operation voltage : 2.4 ~ 5.5V
• Very low power consumption :
Vcc = 3.0V C-grade : 20mA (Max.) operating current
I- grade : 25mA (Max.) operating current
0.02uA (Typ.) CMOS standby current
Vcc = 5.0V C-grade : 35mA (Max.) operating current
I- grade : 40mA (Max.) operating current
0.4uA (Typ.) CMOS standby current
• High speed access time :
-70 70ns (Max.) at Vcc = 3.0V
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE and OE options
• I/O Configuration x8/x16 selectable by LB and UB pin
The BS616LV1010 is a high performance, very low power CMOS Static
Random Access Memory organized as 65,536 words by 16 bits and
operates from a wide range of 2.4V to 5.5V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current
of 0.02uA and maximum access time of 70ns in 3V operation.
Easy memory expansion is provided by an active LOW chip
enable(CE) and active LOW output enable(OE) and three-state output
drivers.
The BS616LV1010 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS616LV1010 is available in the JEDEC standard 44-pin TSOP
Type II and 48-pin BGA package.