Features
l Ideally Suited for Automatic Insertion
l 150
o
C Junction Temperature
l For Switching and AF Amplifier Applications
l Epitaxial Planar Die Construction
Mechanical Data
l Case: SOT-23, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Polarity: See Diagram
l Weight: 0.008 grams ( approx.)
l Marking: BC817-16 6A
BC817-25 6B
BC817-40 6C
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Charateristic Symbol Value Unit
Collector-Emitter Voltage V
CEO
45 V
Emitter-Base Voltage V
EBO
5 V
Collector Current I
C
800 mA
Peak Collector Current I
CM
1000 mA
Peak Emitter Current I
EM
1000 mA
Power Dissipation@T
s
=50
o
C(Note1) P
d
310 mW
Operating & Storage Temperature T
j
, T
STG
-55~150
o
C
Note: 1. Device mounted on Ceramic Substrate 0.7mm X 2.5cm
2
area
BC817-16
THRU
BC817-40
NPN Small
Signal Transistor
310mW

www.mccsemi.com
Suggested Solder
Pad Layout
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .110 .120 2.80 3.04
B .083 .098 2.10 2.64
C .047 .055 1.20 1.40
D .035 .041 .89 1.03
E .070 .081 1.78 2.05
F .018 .024 .45 .60
G .0005 .0039 .013 .100
H .035 .044 .89 1.12
J .003 .007 .085 .180
K .015 .020 .37 .51
A
B
C
D
EF
G H J
.079
2.000
inches
mm
.031
.800
.035
.900
.037
.950
.037
.950
SOT-23
G01G02G03G04G05G06G07G05G08G08G09G04G03G02G0AG0BG06G07omponents
21201 Itasca Street Chatsworth
G07G18G06G19G0FG1AG0FG0F
G1BG15G05G1CG09G1DG06G1EG1FG0FG1FG20G06G21G10G0FG22G23G19G1AG1A
G24G0AG25G1DG06G06G06G1EG1FG0FG1FG20G06G21G10G0FG22G23G19G1AG19
MCC