BAT54
THRU
BAT54S
250mWatt, 30Volt
Schottky Barrier Diode
SOT-23
Suggested Solder
Pad Layout
Features
• Low Forward Voltage
• Surface Mount device
• Very small conduction losses
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .110 .120 2.80 3.04
B .083 .098 2.10 2.64
C .047 .055 1.20 1.40
D .035 .041 .89 1.03
E .070 .081 1.78 2.05
F .018 .024 .45 .60
G .0005 .0039 .013 .100
H .035 .044 .89 1.12
J .003 .007 .085 .180
K .015 .020 .37 .51
MCC
Catalog
Number
Device
Marking Type
Pin
Configuration
Maximum Ratings
Continuos Reverse Voltage V
R
30V
Electrical Characteristics @ 25 °C Unless Otherwise Specified
Ratings Symbol Max. Notes
Forward Voltage at
I
F
= 0.1mA
I
F
= 1mA
I
F
= 10mA
I
F
= 30mA
I
F
= 100mA
V
F
240mV
320mV
400mV
500mV
900mV
Reverse Current I
R
2.0 uA V
R
= 25V
Reverse Breakdown
Voltage
V
(BR)
>30V
Capacitance C
J
10pF Measured at
1.0MHz, V
R
=1.0V
Reverse Recovery
Time
t
rr
5nS I
F
=I
R
=10mA;
I
(REC)
= 1mA
Thermal Resistance,
Junction to Ambient
R
θJA
500K/W
.079
2.000
inches
mm
.031
.800
.035
.900
.037
.950
.037
.950
A
B
C
D
EF
G H J
K
www.mccsemi.com
Forward Current
IF
0.3A
G01G02G03G04G05G06G07G05G08G08G09G04G03G02G0AG0BG06G07omponents
21201 Itasca Street Chatsworth
G07G18G06G19G0FG1AG0FG0F
G1BG15G05G1CG09G1DG06G1EG1FG0FG1FG20G06G21G10G0FG22G23G19G1AG1A
G24G0AG25G1DG06G06G06G1EG1FG0FG1FG20G06G21G10G0FG22G23G19G1AG19
MCC
Non-Repetitive Peak Forward Current t<1s I
FSM
1.0mA
Total Power Dissipation @ T
A
= 25°C PD 250mW
Storage Temperature Range T
stg -55°C to 150°C
Junction Temperature T
j 150°C
BAT54 L4P Single Figure 1
BAT54A L42 Dual Figure 2
BAT54C L43 Dual Figure 3
BAT54S L44 Dual Figure 4
(See Page 3)
Soldering temperature during 10s T
j 260°C