B10S
器件描述：MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER(VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes)
器件厂商：PANJIT [Pan Jit International Inc.]
文件大小：114.04KB，共2页
Sponsor by e络盟器件资料摘要：
PAGE . 1
FEATURES
• Plastic material used carries Underwriters
• Laboratory recognition 94V-O
• Low leakage
• Surge overload rating-- 30 amperes peak
• Ideal for printed circuit board
• Exceeds environmental standards of MIL-S-19500
MECHANICAL DATA
Case: Reliable low cost construction utilizing molded plastic technique results in
inexpensive product
Terminals: Lead solderable per MIL-STD-202, Method 208.
Polarity: Polarity symbols molded or marking on body.
Mounting Position: Any.
Weight: 0.008 ounce, 0.22 gram.
B1S~B10S
MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward on glass-epoxy P.C.B (Note 1)
Current T
A
=30°C on aluminum substrate (Note 3)
Peak Forward Surge Current, 8.3ms singlehalf sine-wave
superimposed on rated load
I
2
t Rating for fusing ( t < 8.35 ms)
Maximum Forward Voltage Drop per Bridge Element at 0.5A
Maximum Reverse Current at Rated T
J
= 25°C
DC Blocking Voltage per element T
J
=125°C
Typical Junction capacitance per leg (Note 1) CJ
Typical Thermal resistance per leg (Note 2) RθJA
Typical Thermal resistance per leg (Note 2) RθJA
Operating Temperature Range T
J
Storage Temperature Range T
A
UNIT
NOTES:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.05 X 0.05"(13 x 13mm) copper pads.
3. On alum: substrate P.C.B with an rea of 0.8 x 0.8 x 0.25” ( 20 x 20 x 6.4mm ) mounte on 0.05 x 0.05 “( 13 x 13 mm ) solder pad.
DATA SHEET
MDI
Unit: inch ( mm )
.0310
(0.8)
.0191
(0.5)
.193
(4.9)
.177
(4.5)
.106
(2.7)
.090
(2.3)
.165 (4.2)
.150 (3.8)
.043 (1.1)
.027 (0.7)
.014
(0.35)
.006
(0.15)
.008 (.20)
.051 (1.3)
.035 (0.9)
.067 (1.7)
.057 (1.3)
.275 (7) MAX
.106 (2.7)
.090 (2.3)
C .02(5)
µA
mA
B1S B2S B4S B6S B8S
100
V
70
V
100
V
0.5
0.8
A
30.0
A
5.0
V
A
2
t
1.00
5.0
25.0
85.0
-55 to 150
-55 to 150
°C
°C
°C/W
pF
200
140
200
400
280
400
600
420
600
800
560
800
B10S
1000
700
1000
FEATURES
• Plastic material used carries Underwriters
• Laboratory recognition 94V-O
• Low leakage
• Surge overload rating-- 30 amperes peak
• Ideal for printed circuit board
• Exceeds environmental standards of MIL-S-19500
MECHANICAL DATA
Case: Reliable low cost construction utilizing molded plastic technique results in
inexpensive product
Terminals: Lead solderable per MIL-STD-202, Method 208.
Polarity: Polarity symbols molded or marking on body.
Mounting Position: Any.
Weight: 0.008 ounce, 0.22 gram.
B1S~B10S
MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward on glass-epoxy P.C.B (Note 1)
Current T
A
=30°C on aluminum substrate (Note 3)
Peak Forward Surge Current, 8.3ms singlehalf sine-wave
superimposed on rated load
I
2
t Rating for fusing ( t < 8.35 ms)
Maximum Forward Voltage Drop per Bridge Element at 0.5A
Maximum Reverse Current at Rated T
J
= 25°C
DC Blocking Voltage per element T
J
=125°C
Typical Junction capacitance per leg (Note 1) CJ
Typical Thermal resistance per leg (Note 2) RθJA
Typical Thermal resistance per leg (Note 2) RθJA
Operating Temperature Range T
J
Storage Temperature Range T
A
UNIT
NOTES:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.05 X 0.05"(13 x 13mm) copper pads.
3. On alum: substrate P.C.B with an rea of 0.8 x 0.8 x 0.25” ( 20 x 20 x 6.4mm ) mounte on 0.05 x 0.05 “( 13 x 13 mm ) solder pad.
DATA SHEET
MDI
Unit: inch ( mm )
.0310
(0.8)
.0191
(0.5)
.193
(4.9)
.177
(4.5)
.106
(2.7)
.090
(2.3)
.165 (4.2)
.150 (3.8)
.043 (1.1)
.027 (0.7)
.014
(0.35)
.006
(0.15)
.008 (.20)
.051 (1.3)
.035 (0.9)
.067 (1.7)
.057 (1.3)
.275 (7) MAX
.106 (2.7)
.090 (2.3)
C .02(5)
µA
mA
B1S B2S B4S B6S B8S
100
V
70
V
100
V
0.5
0.8
A
30.0
A
5.0
V
A
2
t
1.00
5.0
25.0
85.0
-55 to 150
-55 to 150
°C
°C
°C/W
pF
200
140
200
400
280
400
600
420
600
800
560
800
B10S
1000
700
1000