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Vicor Corporation
Tel: 800-735-6200 V•I Chip Bus Converter B048K120T15 Rev. 1.2 Page 1 of 16
vicorpower.com
PRELIMIN
AR
Y
Product Description
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a pre-regulated 48 Vdc primary bus
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
applications. The BCM may be used to
power non-isolated POL converters or as
an independent 12 V source. Due to the
fast response time and low noise of the
BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the
input of POL converters is reduced—or
eliminated—resulting in savings of board
area, materials and total system cost.
The BCM achieves a power density of
600 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power BGA package
is compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
Absolute Maximum Ratings
Parameter Values Unit Notes
+In to -In -1.0 to 60.0 Vdc
+In to -In 100 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc
TM to -In -0.3 to 7.0 Vdc
SG to -In 500 mA
+Out to -Out -0.5 to 15.0 Vdc
Isolation voltage 1500 Vdc Input to Output
Operating junction temperature -40 to 125 °C See note 2
Output current 12.5 A Continuous
Peak output current 18.7 A For 1 ms
Case temperature during reflow 208 °C
Storage temperature -40 to 150 °C
Output power 150 W Continuous
Peak output power 225 W For 1 ms
Thermal Resistance
Symbol Parameter Typ Max Units
RθJC Junction-to-case 1.1 1.5 °C/W
RθJB Junction-to-BGA 2.1 2.5 °C/W
RθJA Junction-to-ambient
3
6.5 7.2 °C/W
RθJA Junction-to-ambient
4
5.0 5.5 °C/W
• 48V to 12V V•I Chip Converter
• 150 Watt (225 Watt for 1 ms)
•High density – up to 600 W/in
3
•Small footprint – 150 W/in
2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
• 125°C operation
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
•V•I ChipBGA package
B048K120T15
1
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 12.5 A
K =
1
/
4
Rout = 32 mΩ max
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T15 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T15 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Actual size
©
V•I Chip
TM
– BCM
Bus Converter Module