Heatsinks
1/5
www.dynexsemi.com
200W
0.3
0.32
0.34
0.36
0.38
0.4
0.42
0.44
0.46
0.48
0.5
125 175 225 275 325 375
HEATSINK LENGTH (mm)
THERMAL
RESIST
ANCE (˚C/W)
Heatsink profile: EDForced air (5m/s)Air natural
AIR COOLED HEATSINKS
All dimensions shown in mm unless stated otherwise.
175
77.5
M8 slots
27
Cross sectional area (cm
2
): 52.3
Weight kg/m: 141.2
120
222 ± 1
M6 slot
M8 slots
50
Cross sectional area (cm
2
): 124.08
Weight kg/m: 31
200W
0.12
0.125
0.13
0.135
0.14
0.145
0.15
125 165 205 245 285
HEATSINK LENGTH (mm)
THERMAL
RESIST
ANCE (˚C/W)
200 W
0.3
0.32
0.34
0.36
0.38
0.4
0.42
0.44
125 175 225 275 325 375
HEATSINK LENGTH (mm)
THERMAL
RESIST
ANCE (˚C/W)
200W
0.075
0.08
0.085
0.09
0.095
0.1
125 175 225 275 325 375
HEATSINK LENGTH (mm)
THERMAL
RESIST
ANCE (˚C/W)
Heatsink profile: EMForced air (5m/s)Air natural
The current range of heatsinks is illustrated with a brief
resumé of their characteristics. The products available are
intended for use with all our power semiconductors - from
the small stud base through to large disc devices and
modules.
All heatsinks are suitable for Natural Air Cooling (AN) and
Forced Air Cooling (FC). In addition to a vast experience of
AN and FC cooling methods we also have many years
experience in liquid and phase change cooling.
A range of coolers for 17mm to 100mm silicon diameter
devices is available, as is a range of associated clamps.
HEATSINKS
Power Assemblies
DS5404-1.0 November 2000