ACT-RS128K32N-035F1I
器件描述:RAD Tolerant ACT-RS128K32 High Speed 4 Megabit SRAM Multichip Module
文件大小:137.6KB,共8页
Sponsor by e络盟
器件资料摘要:
eroflex Circuit Technology - Advanced Multichip Modules © SCD3659 REV 3 12/17/98
128Kx8 128Kx8 128Kx8 128Kx8
CE4
OE
A0 – A16
I/O0-7 I/O8-15 I/O16-23 I/O24-31
8 8 8 8
CE3
WE
CE1 CE2
Block Diagram – PGA Type Package(P1) & CQFP(F2)
128Kx8 128Kx8 128Kx8 128Kx8
CE4
OE
A0 – A16
I/O0-7 I/O8-15 I/O16-23 I/O24-31
8 8 8 8
CE3 WE4WE3WE2WE1 CE1 CE2
Block Diagram – CQFP(F1)
Pin Description
I/O0-31 Data I/O
A0–16 Address Inputs
WE1–4 Write Enables
CE1–4 Chip Enables
OE Output Enable
Vcc Power Supply
GND Ground
NC Not Connected
Pin Description
I/O0-31 Data I/O
A0–16 Address Inputs
WE Write Enable
CE1–4 Chip Enables
OE Output Enable
Vcc Power Supply
GND Ground
NC Not Connected
General Description
The ACT–RS128K32 is a High
Speed 4 megabit CMOS SRAM
Multichip Module (MCM)
designed for full temperature
range, military, space, or high
reliability mass memory and
fast cache applications.
The MCM can be organized
as a 128K x 32 bits, 256K x 16
bits or 512k x 8 bits device and
is input and output TTL
compatible. Writing is executed
when the write enable (WE)
and chip enable (CE) inputs are
low. Reading is accomplished
when WE is high and CE and
output enable (OE) are both
low. Access time grades of
35ns and 45ns maximum are
standard.
The +5 Volt power supply
version is standard.
The products are designed for
operation over the temperature
range of -55°C to +125°C and
screened under the full military
environment. DESC Standard
Military Drawing (SMD) part
numbers are pending.
The ACT-RS128K32 is
manufactured in Aeroflex’s
80,000ft2 MIL-PRF-38534
certified facility in Plainview,
N.Y.
Features
a73 4 Low Power CMOS 128K x 8 SRAMs in one MCM
a73 Overall configuration as 128K x 32
a73 Tolerant to 30KRad (Si)
a73 Latch-up Immunity to 112MeV/(mg/cm2)
a73 Input and Output TTL Compatible
a73 35 & 45ns Access Times
a73 Full Military (-55°C to +125°C) Temperature Range
a73 For Class K devices per MIL-PRF-38534 - Consult Factory
a73 +5V Power Supply
a73 Choice of 4 Hermetically sealed Co-fired Packages:
a71 68–Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max
a71 68–Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness
available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ
CQFJ footprint)
a71 66–Lead, PGA-Type (P1), 1.385"SQ x .245"max
a73 Internal Decoupling Capacitors
CIRCUIT TECHNOLOGY
www.aeroflex.com/act1.htm
4 Megabit SRAM Multichip Module
ACT–RS128K32 High Speed
RAD Tolerant
Preliminary