© 2005 Fairchild Semiconductor Corporation DS012016 www.fairchildsemi.com
September 1999
Revised March 2005
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VTH374
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74LVT374 74LVTH374
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT374 and LVTH374 are high-speed, low-power
octal D-type flip-flops featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented appli-
cations. A buffered Clock (CP) and Output Enable (OE) are
common to all flip-flops.
The LVTH374 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal flip-flops are designed for low-voltage (3.3V)
V
CC
applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT374 and LVTH374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining low power dissipation.
Features
a73 Input and output interface capability to systems at
5V V
CC
a73 Bus-Hold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH374),
also available without bushold feature (74LVT374).
a73 Live insertion/extraction permitted
a73 Power Up/Down high impedance provides glitch-free
bus loading
a73 Outputs source/sink c1632 mA/c1464 mA
a73 Functionally compatible with the 74 series 374
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human-body model c33 2000V
Machine model c33 200V
Charged-device model c33 1000V

Ordering Code:
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Logic Symbols
IEEE/IEC
Order Number
Package
Package Description
Number
74LVT374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT374SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH374SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH374MTCX_NL
(Note 1)
MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide