© 2005 Fairchild Semiconductor Corporation DS012022 www.fairchildsemi.com
January 1999
Revised June 2005
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74LVT16374 74LVTH16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT16374 and LVTH16374 contain sixteen non-invert-
ing D-type flip-flops with 3-STATE outputs and is intended
for bus oriented applications. The device is byte controlled.
A buffered clock (CP) and Output Enable (OE) are com-
mon to each byte and can be shorted together for full 16-bit
operation.
The LVTH16374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) V
CC
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVT16374 and LVTH16374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
a73 Input and output interface capability to systems at
5V V
CC
a73 Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16374),
also available without bushold feature (74LVT16374)
a73 Live insertion/extraction permitted
a73 Power Up/Power Down high impedance provides
glitch-free bus loading
a73 Outputs source/sink c1632 mA/c1464 mA
a73 Functionally compatible with the 74 series 16374
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human-body model c33 2000V
Machine model c33 200V
Charged-device model c33 1000V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)

Ordering Code:
Note 1: Ordering code “G” indicates Trays.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74LVT16374G
(Note 1)(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVT16374MEA
(Note 2)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16374MTD
(Note 2)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16374G
(Note 1)(Note 2)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH16374MEA
(Note 2)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16374MTD
(Note 2)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide