74LCXZ16245
器件描述：Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs
器件厂商：FAIRCHILD [Fairchild Semiconductor]
文件大小：92.1KB，共8页
Sponsor by e络盟器件资料摘要：
© 2002 Fairchild Semiconductor Corporation DS500580 www.fairchildsemi.com
March 2002
Revised March 2002
7
4
LCXZ16245 Low
V
o
lt
age 16-Bi
t Bidi
rect
i
onal T
r
ans
ceiver
wi
th 5V
T
o
l
e
ran
t
Input
s
a
nd
Out
puts
74LCXZ16245
Low Voltage 16-Bit Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
The LCXZ16245 contains sixteen non-inverting bidirec-
tional buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is designed for low volt-
age (2.7V or 3.3V) V
CC
applications with capability of inter-
facing to a 5V signal environment. The device is byte
controlled. Each byte has separate control inputs which
could be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
When V
CC
is between 0V and 1.5V, the LCXZ16245 is on
the high impedance state during power-up or power-down.
This places the outputs in the high impedance (Z) state
preventing intermittent low impedance loading or glitching
in bus oriented applications.
The LCXZ16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
a73 5V tolerant inputs and outputs
a73 2.7V–3.6V V
CC
specifications provided
a73 4.5 ns t
PD
max (V
CC
= 3.3V), 20 µA I
CC
max
a73 Power-down high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 ±24 mA output drive (V
CC
= 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance conforms to the requirements of
JESD78
a73 ESD performance:
Human body model > 2000V
Machine model > 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 2: BGA package available in Tape and Reel only.
Logic Symbol
Order Number Package Number Package Description
74LCXZ16245GX
(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LCXZ16245MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
March 2002
Revised March 2002
7
4
LCXZ16245 Low
V
o
lt
age 16-Bi
t Bidi
rect
i
onal T
r
ans
ceiver
wi
th 5V
T
o
l
e
ran
t
Input
s
a
nd
Out
puts
74LCXZ16245
Low Voltage 16-Bit Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
The LCXZ16245 contains sixteen non-inverting bidirec-
tional buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is designed for low volt-
age (2.7V or 3.3V) V
CC
applications with capability of inter-
facing to a 5V signal environment. The device is byte
controlled. Each byte has separate control inputs which
could be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
When V
CC
is between 0V and 1.5V, the LCXZ16245 is on
the high impedance state during power-up or power-down.
This places the outputs in the high impedance (Z) state
preventing intermittent low impedance loading or glitching
in bus oriented applications.
The LCXZ16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
a73 5V tolerant inputs and outputs
a73 2.7V–3.6V V
CC
specifications provided
a73 4.5 ns t
PD
max (V
CC
= 3.3V), 20 µA I
CC
max
a73 Power-down high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 ±24 mA output drive (V
CC
= 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance conforms to the requirements of
JESD78
a73 ESD performance:
Human body model > 2000V
Machine model > 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 2: BGA package available in Tape and Reel only.
Logic Symbol
Order Number Package Number Package Description
74LCXZ16245GX
(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LCXZ16245MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide