74LCX162374
器件描述：Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs and 26з Series Resistors
器件厂商：FAIRCHILD [Fairchild Semiconductor]
文件大小：218.77KB，共10页
Sponsor by e络盟器件资料摘要：
© 2001 Fairchild Semiconductor Corporation DS500442 www.fairchildsemi.com
February 2001
Revised August 2001
7
4
LCX162374
Low
V
o
lt
age 16
-Bit
D-
T
y
pe Fl
i
p
-Fl
op wi
th
5V T
o
le
rant
I
nputs
and Out
puts
and
26
Ω
Seri
es
Res
i
st
ors
74LCX162374
Low Voltage 16-Bit D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
and 26Ω Series Resistors
General Description
The LCX162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The LCX162374 is designed for low voltage (2.5V or 3.3V)
V
CC
applications with capability of interfacing to a 5V signal
environment. The 26Ω series resistor in the output helps
reduce output overshoot and undershoot.
The LCX162374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
a73 5V tolerant inputs and outputs
a73 2.3V–3.6V V
CC
specifications provided
a73 Equivalent 26Ω series resistor on outputs
a73 7.0 ns t
PD
max (V
CC
= 3.3V), 20 µA I
CC
max
a73 Power down high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 ±12 mA output drive (V
CC
= 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human body model > 2000V
Machine model > 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74LCX162374GX
(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LCX162374MEA
(Note 3)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX162374MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
February 2001
Revised August 2001
7
4
LCX162374
Low
V
o
lt
age 16
-Bit
D-
T
y
pe Fl
i
p
-Fl
op wi
th
5V T
o
le
rant
I
nputs
and Out
puts
and
26
Ω
Seri
es
Res
i
st
ors
74LCX162374
Low Voltage 16-Bit D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
and 26Ω Series Resistors
General Description
The LCX162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The LCX162374 is designed for low voltage (2.5V or 3.3V)
V
CC
applications with capability of interfacing to a 5V signal
environment. The 26Ω series resistor in the output helps
reduce output overshoot and undershoot.
The LCX162374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
a73 5V tolerant inputs and outputs
a73 2.3V–3.6V V
CC
specifications provided
a73 Equivalent 26Ω series resistor on outputs
a73 7.0 ns t
PD
max (V
CC
= 3.3V), 20 µA I
CC
max
a73 Power down high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 ±12 mA output drive (V
CC
= 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human body model > 2000V
Machine model > 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74LCX162374GX
(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LCX162374MEA
(Note 3)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX162374MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide