74LCX162244
器件描述:Low Voltage 16-Bit Buffer/Line Driver with 26з Series Resistors in Outputs
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器件资料摘要:
© 2001 Fairchild Semiconductor Corporation DS500471 www.fairchildsemi.com
September 2000
Revised August 2001
7
4
LCX162244 Low
V
o
lt
age 16-Bi
t Buff
er/
L
in
e
Dri
ver
wit
h
26
Ω
Seri
es Resist
ors i
n
Out
puts
74LCX162244
Low Voltage 16-Bit Buffer/Line Driver
with 26Ω Series Resistors in Outputs
General Description
The LCX162244 contains sixteen non-inverting buffers with
3-STATE outputs designed to be employed as a memory
and address driver, clock driver, or bus oriented transmit-
ter/receiver. The device is nibble controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
The LCX162244 is designed for low voltage (2.5V or 3.3V)
V
CC
applications with capability of interfacing to a 5V signal
environment.
In addition, the outputs include equivalent 26Ω (nominal)
series resistors to reduce overshoot and undershoot and
are designed to sink/source up to 12 mA at V
CC
= 3.0V.
The LCX162244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
a73 5V tolerant inputs and outputs
a73 2.3V–3.6V V
CC
specifications provided
a73 Outputs include equivalent series resistance of 26Ω to
make external termination resistors unnecessary and
reduce overshoot and undershoot
a73 5.3 ns t
PD
max (V
CC
= 3.0V), 20 µA I
CC
max
a73 Power down high impedance inputs and outputs
a73 ±12 mA output drive (V
CC
= 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human body model > 2000V
Machine model > 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74LCX162244GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LCX162244MEA
(Note 2)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX162244MTD
(Note 2)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide