© 2005 Fairchild Semiconductor Corporation DS012445 www.fairchildsemi.com
March 1999
Revised June 2005
7
4
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62244
• 74L
VTH162244
Low
V
o
l
t
age
16-Bi
t
Buff
er/
L
i
ne Dr
iver
wit
h

3-ST
A
T
E Out
put
s an
d 25
G58
S
e
ri
es
Res
i
st
ors in the

Outp
ut
s
74LVT162244 74LVTH162244
Low Voltage 16-Bit Buffer/Line Driver
with 3-STATE Outputs
and 25G58 Series Resistors in the Outputs
General Description
The LVT162244 and LVTH162244 contain sixteen non-
inverting buffers with 3-STATE outputs designed to be
employed as a memory and address driver, clock driver, or
bus oriented transmitter/receiver. The device is nibble con-
trolled. Individual 3-STATE control inputs can be shorted
together for 8-bit or 16-bit operation.
The LVT162244 and LVTH162244 are designed with
equivalent 25c58 series resistance in both the HIGH and
LOW states of the output. This design reduces line noise in
applications such as memory address drivers, clock driv-
ers, and bus transceivers/transmitters.
The LVTH162244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) V
CC
applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT162244 and
LVTH162244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Features
a73 Input and output interface capability to systems at
5V V
CC
a73 Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH162244),
also available without bushold feature (74LVT162244).
a73 Live insertion/extraction permitted
a73 Power Up/Power Down high impedance provides glitch-
free bus loading
a73 Outputs include equivalent series resistance of 25c58 to
make external termination resistors unnecessary and
reduce overshoot and undershoot
a73 Functionally compatible with the 74 series 162244
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human-body model c33 2000V
Machine model c33 200V
Charged-device c33 1000V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)

Ordering Code:
Note 1: Ordering code “G” indicates Trays.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Order Number
Package
Number
Package Description
74LVT162244G
(Note 1)(Note 2)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVT162244MEA
(Note 2)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT162244MTD
(Note 2)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH162244G
(Note 1)(Note 2)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tube]
74LVTH162244MEX MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tape and Reel]
74LVTH162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tube]
74LVTH162244MTX MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tape and Reel]