74ALVC16374
器件描述：Low Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
器件厂商：FAIRCHILD [Fairchild Semiconductor]
文件大小：122.83KB，共8页
Sponsor by e络盟器件资料摘要：
© 2005 Fairchild Semiconductor Corporation DS500692 www.fairchildsemi.com
October 2001
Revised May 2005
7
4
AL
VC1637
4
Low V
o
l
t
age 16-
B
i
t D-T
ype
Fl
ip-
F
lop
wit
h
3
.
6V T
o
ler
ant Inp
u
t
s
and Outpu
t
s
74ALVC16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16374 contains sixteen non-inverting D-type flip-
flops with 3-STATE outputs and is intended for bus oriented
applications. The device is byte controlled. A buffered clock
(CP) and output enable (OE) are common to each byte and
can be shorted together for full 16-bit operation.
The 74ALVC16374 is designed for low voltage (1.65V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74ALVC16374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
a73 1.65V - 3.6V V
CC
supply operation
a73 3.6V tolerant inputs and outputs
a73 t
PD
3.5 ns max for 3.0V to 3.6V V
CC
4.4 ns max for 2.3V to 2.7V V
CC
7.8 ns max for 1.65V to 1.95V V
CC
a73 Power-off high impedance inputs and outputs
a73 Supports live insertion and withdrawal (Note 1)
a73 Uses patented noise/EMI reduction circuitry
a73 Latchup conforms to JEDEC JED78
a73 ESD performance:
Human body model c33 2000V
Machine model c33 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Order Number Package Number Package Descriptions
74ALVC16374GX
(Note 2)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74ALVC16374MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
October 2001
Revised May 2005
7
4
AL
VC1637
4
Low V
o
l
t
age 16-
B
i
t D-T
ype
Fl
ip-
F
lop
wit
h
3
.
6V T
o
ler
ant Inp
u
t
s
and Outpu
t
s
74ALVC16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16374 contains sixteen non-inverting D-type flip-
flops with 3-STATE outputs and is intended for bus oriented
applications. The device is byte controlled. A buffered clock
(CP) and output enable (OE) are common to each byte and
can be shorted together for full 16-bit operation.
The 74ALVC16374 is designed for low voltage (1.65V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74ALVC16374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
a73 1.65V - 3.6V V
CC
supply operation
a73 3.6V tolerant inputs and outputs
a73 t
PD
3.5 ns max for 3.0V to 3.6V V
CC
4.4 ns max for 2.3V to 2.7V V
CC
7.8 ns max for 1.65V to 1.95V V
CC
a73 Power-off high impedance inputs and outputs
a73 Supports live insertion and withdrawal (Note 1)
a73 Uses patented noise/EMI reduction circuitry
a73 Latchup conforms to JEDEC JED78
a73 ESD performance:
Human body model c33 2000V
Machine model c33 200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Order Number Package Number Package Descriptions
74ALVC16374GX
(Note 2)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74ALVC16374MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide