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厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

7C199-10

器件描述:32K x 8 Static RAM
器件厂商:CYPRESS [Cypress Semiconductor]
文件大小:317.03KB,共13页
Sponsor by e络盟
器件资料摘要:
CY7C199
32K x 8 Static RAM
Cypress Semiconductor Corporation • 3901 North First Street San Jose, CA 95134 408-943-2600
Document #: 38-05160 Rev. *A Revised January 7, 2003
Features
• High speed
— 10 ns
Fast t
DOE
CMOS for optimum speed/power
Low active power
— 467 mW (max, 12 ns “L” version)
Low standby power
— 0.275 mW (max, “L” version)
2V data retention (“L” version only)
Easy memory expansion with CE and OE features
TTL-compatible inputs and outputs
Automatic power-down when deselected
Functional Description
The CY7C199 is a high-performance CMOS static RAM
organized as 32,768 words by 8 bits. Easy memory expansion
is provided by an active LOW Chip Enable (CE) and active
LOW Output Enable (OE) and three-state drivers. This device
has an automatic power-down feature, reducing the power
consumption by 81% when deselected. The CY7C199 is in the
standard 300-mil-wide DIP, SOJ, and LCC packages.
An active LOW Write Enable signal (WE) controls the
writing/reading operation of the memory. When CE and WE
inputs are both LOW, data on the eight data input/output pins
(I/O
0
through I/O
7
) is written into the memory location
addressed by the address present on the address pins (A
0
through A
14
). Reading the device is accomplished by selecting
the device and enabling the outputs, CE and OE active LOW,
while WE remains inactive or HIGH. Under these conditions,
the contents of the location addressed by the information on
address pins are present on the eight data input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and Write Enable
(WE) is HIGH. A die coat is used to improve alpha immunity.
Logic Block Diagram
Pin Configurations
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
COLUMN
DECODER
ROW DE
CODER
S
E
N
S
E AM
PS
INPUT BUFFER
POWER
DOWN
WE
OE
I/O
0
CE
I/O
1
I/O
2
I/O
3
1
2
3
4
5
6
7
8
9
10
11
14
15
16
20
19
18
17
21
24
23
22
Top View
DIP / SOJ / SOIC
12
13
25
28
27
26
GND
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
WE
V
CC
A
4
A
3
A
2
A
1
I/O
7
I/O
6
I/O
5
I/O
4
A
14
A
5
I/O
0
I/O
1
I/O
2
CE
OE
A
0
I/O
3
1024 x 32 x 8
ARRAY
I/O
7
I/O
6
I/O
5
I/O
4
A
9
A
0
A
11
A
13
A
12
A
14
A
10
28
4
5
6
7
8
9
10
321 27
1314151617
26
25
24
23
22
21
20
11
12
19
18
A
7
V
CC
I/
O
5
GND
WEA
6
A
5
I/
O
4
I/
O
3
I/
O
2
A
8
A
9
A
10
A
11
A
12
A
13
A
14
CE
A
3
A
2
A
1
A
0
I/O
1
I/O
7
I/O
6
A
4
OE
I/O
0
Top View
LCC
22
23
24
25
26
27
28
1
2
5
10
11
15
14
13
12
16
19
18
17
3
4
20
21
7
6
8
9
OE
A
1
A
2
A
3
A
4
WE
V
CC
A
5
A
6
A 7
A
8
A
9
A
0
CE
I/O
7
I/O
6
I/O
5
GND
I/O
2
I/O
1
I/O
4
I/O
0
A
14
A
10
A
11
A
13
A
12
I/O
3
TSOP I
Top View
(not to scale)
Selection Guide
7C199
-8
7C199
-10
7C199
-12
7C199
-15
7C199
-20
7C199
-25
7C199
-35
7C199
-45 Unit
Maximum Access Time 81 12 15 20 25 35 45 ns
Maximum Operating Current 120 110 160 155 150 150 140 140 mA
L 90 90 90 90 80 70
Maximum CMOS Standby Current 0.5 0.5 10 10 10 10 10 10 mA
L 0.05 0.05 0.05 0.05 0.05 0.05
Shaded area contains advance information.