61055
器件描述：SILICON PHOTOTRANSISTOR “PILL PACK”
器件厂商：MICROPAC [Micropac Industries]
文件大小：90.1KB，共3页
Sponsor by e络盟器件资料摘要：
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 487-6918
www.micropac.com E-MAIL: optosales@micropac.com
6 - 10
61055 SILICON PHOTOTRANSISTOR “PILL PACK”
(TYPE GS1020)
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
REVISION B 02/22/01
Features:
• Hermetically sealed
• High sensitivity
• Small package
• Suitable for high-density pc board mounting
• Spectrally matched to the 62000 Series LED.
Applications:
• Incremental Encoding
• Reflective Sensors
• Position Sensors
• Level Sensors
DESCRIPTION
The 61055 is an N-P-N Planar Silicon Transistor in a package designed to be mounted in a double-clad printed circuit
board. It is available in a range of sensitivities and is lensed for minimum response to stray light. High sensitivity, low dark
current leakage, and low saturation voltage make this device ideal for interfacing with TTL circuits. Available custom binned
to customer specifications or screened to MIL-PRF-19500.
ABSOLUTE MAXIMUM RATINGS
Storage Temperature..........................................................................................................................................-65°C to +150°C
Operating Temperature ....................................................................................................................................-55°C to +125°C
Collector-Emitter Voltage........................................................................................................................................................50V
Emitter-Collector Voltage..........................................................................................................................................................6V
Power Dissipation (Derate at the rate of 0.5 mW/°C above 25°C) ....................................................................................50mW
Lead Soldering Temperature (10 seconds) ....................................................................................................................... 240°C
Package Dimensions Schematic Diagram
0.088 [2.24]
0.082 [2.08]
0.115 [2.92]
0.102 [2.59]
0.010 [0.25]
0.005 [0.013]
0.240 [0.61]
0.016 [0.41]
COLLECTOR
CERAMIC
EMITTER
LENS
R0.010 ±0.001 [0.25]
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
Ø0.061 [1.55]
Ø0.058 [1.47]
0.019 [0.48]
0.009 0.23]
0.092 [2.34]
0.084 [2.13]
0.067 [1.70]
0.063 [1.60]
C
E
www.micropac.com E-MAIL: optosales@micropac.com
6 - 10
61055 SILICON PHOTOTRANSISTOR “PILL PACK”
(TYPE GS1020)
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
REVISION B 02/22/01
Features:
• Hermetically sealed
• High sensitivity
• Small package
• Suitable for high-density pc board mounting
• Spectrally matched to the 62000 Series LED.
Applications:
• Incremental Encoding
• Reflective Sensors
• Position Sensors
• Level Sensors
DESCRIPTION
The 61055 is an N-P-N Planar Silicon Transistor in a package designed to be mounted in a double-clad printed circuit
board. It is available in a range of sensitivities and is lensed for minimum response to stray light. High sensitivity, low dark
current leakage, and low saturation voltage make this device ideal for interfacing with TTL circuits. Available custom binned
to customer specifications or screened to MIL-PRF-19500.
ABSOLUTE MAXIMUM RATINGS
Storage Temperature..........................................................................................................................................-65°C to +150°C
Operating Temperature ....................................................................................................................................-55°C to +125°C
Collector-Emitter Voltage........................................................................................................................................................50V
Emitter-Collector Voltage..........................................................................................................................................................6V
Power Dissipation (Derate at the rate of 0.5 mW/°C above 25°C) ....................................................................................50mW
Lead Soldering Temperature (10 seconds) ....................................................................................................................... 240°C
Package Dimensions Schematic Diagram
0.088 [2.24]
0.082 [2.08]
0.115 [2.92]
0.102 [2.59]
0.010 [0.25]
0.005 [0.013]
0.240 [0.61]
0.016 [0.41]
COLLECTOR
CERAMIC
EMITTER
LENS
R0.010 ±0.001 [0.25]
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
Ø0.061 [1.55]
Ø0.058 [1.47]
0.019 [0.48]
0.009 0.23]
0.092 [2.34]
0.084 [2.13]
0.067 [1.70]
0.063 [1.60]
C
E