Philips Semiconductors Product Specification
PowerMOS transistor BUK444-200A/B
GENERAL DESCRIPTION QUICK REFERENCE DATA
N-channel enhancement mode SYMBOL PARAMETER MAX. MAX. UNIT
field-effect power transistor in a
plastic full-pack envelope. BUK444 -200A -200B
The device is intended for use in V
DS
Drain-source voltage 200 200 V
Switched Mode Power Supplies I
D
Drain current (DC) 5.3 4.7 A
(SMPS), motor control, welding, P
tot
Total power dissipation 25 25 W
DC/DC and AC/DC converters, and R
DS(ON)
Drain-source on-state 0.4 0.5 Ω
in general purpose switching resistance
applications.
PINNING - SOT186 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 gate
2 drain
3 source
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
Drain-source voltage - - 200 V
V
DGR
Drain-gate voltage R
GS
= 20 kΩ - 200 V
±V
GS
Gate-source voltage - - 30 V
-200A -200B
I
D
Drain current (DC) T
hs
= 25 ˚C - 5.3 4.7 A
I
D
Drain current (DC) T
hs
= 100 ˚C - 3.3 3.0 A
I
DM
Drain current (pulse peak value) T
hs
= 25 ˚C - 21 19 A
P
tot
Total power dissipation T
hs
= 25 ˚C - 25 W
T
stg
Storage temperature - - 55 150 ˚C
T
j
Junction Temperature - - 150 ˚C
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-hs
Thermal resistance junction to with heatsink compound - - 5 K/W
heatsink
R
th j-a
Thermal resistance junction to - 55 - K/W
ambient
123
case
d
g
s
April 1993 1 Rev 1.100