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厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

28F128

器件描述:3 Volt Intel StrataFlash Memory
器件厂商:INTEL [Intel Corporation]
厂商主页:http://www.intel.com/
文件大小:380.43KB,共60页
Sponsor by e络盟
器件资料摘要:
3 Volt Intel
®
StrataFlash™ Memory
28F128J3A, 28F640J3A, 28F320J3A (x8/x16)
Preliminary Datasheet
Product Features
Capitalizing on Intel’s 0.25 µ generation two-bit-per-cell technology, second generation Intel
®

StrataFlash™ memory products provide 2X the bits in 1X the space, with new features for mainstream
performance. Offered in 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit densities, these devices bring
reliable, two-bit-per-cell storage technology to the flash market segment.
Benefits include: more density in less space, high-speed interface, lowest cost-per-bit NOR devices,
support for code and data storage, and easy migration to future devices.
Using the same NOR-based ETOX™ technology as Intel’s one-bit-per-cell products, Intel StrataFlash
memory

devices take advantage of over one billion units of manufacturing experience since 1987. As a
result, Intel StrataFlash components are ideal for code and data applications where high density and low
cost are required. Examples include networking, telecommunications, digital set top boxes, audio
recording, and digital imaging.
By applying FlashFile™ memory family pinouts, Intel StrataFlash memory components allow easy design
migrations from existing Word-Wide FlashFile memory (28F160S3 and 28F320S3), and first generation
Intel StrataFlash memory (28F640J5 and 28F320J5) devices.
Intel StrataFlash memory components deliver a new generation of forward-compatible software support.
By using the Common Flash Interface (CFI) and the Scalable Command Set (SCS), customers can take
advantage of density upgrades and optimized write capabilities of future Intel StrataFlash memory devices.
Manufactured on Intel
®
0.25 micron ETOX™ VI process technology, Intel StrataFlash memory provides
the highest levels of quality and reliability.
a73 High-Density Symmetrically-Blocked
Architecture
—128 128-Kbyte Erase Blocks (128 M)
—64 128-Kbyte Erase Blocks (64 M)
—32 128-Kbyte Erase Blocks (32 M)
a73 High Performance Interface Asynchronous
Page Mode Reads
—110/25 ns Read Access Time (32 M)
—120/25 ns Read Access Time (64 M)
—150/25 ns Read Access Time (128 M)
a73 2.7 V–3.6 V V
CC
Operation
a73 128-bit Protection Register
—64-bit Unique Device Identifier
—64-bit User Programmable OTP Cells
a73 Enhanced Data Protection Features
Absolute Protection with V
PEN
= GND
—Flexible Block Locking
—Block Erase/Program Lockout during
Power Transitions
a73 Packaging
—56-Lead TSOP Package
—64-Ball Intel
®

Easy BGA Package
a73 Cross-Compatible Command Support Intel
Basic Command Set
—Common Flash Interface
—Scalable Command Set
a73 32-Byte Write Buffer
—6 µs per Byte Effective Programming
Time
a73 12.8M Total Min. Erase Cycles (128 Mbit)
6.4M Total Min. Erase Cycles (64 Mbit)
3.2M Total Min. Erase Cycles (32 Mbit)
—100K Minimum Erase Cycles per Block
a73 Automation Suspend Options
—Block Erase Suspend to Read
—Block Erase Suspend to Program
—Program Suspend to Read
a73 0.25 µ Intel
®

StrataFlash™ Memory
Technology
Order Number: 290667-008
April 2001
Notice: This document contains preliminary information on new products in production. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.