1N6478 THRU 1N6484
SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
FEATURES
♦ Plastic package has
Underwriters Laboratory
Flammability Classification 94V-0
♦ For surface mount applications
♦ High temperature metallurgically
bonded construction
♦ Glass passivated cavity-free junction
♦ Capable of meeting environmental standards of
MIL-S-19500
♦ High temperature soldering guaranteed:
450°C/5 seconds at terminals.
Complete device submersible temperature of
265°C for 10 seconds in solder bath
MECHANICAL DATA
Case: JEDEC DO-213AB molded plastic over glass body
Terminals: Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity: Two bands indicate cathode end - 1st band
denotes device type and 2nd band denotes repetitive peak
reverse voltage rating
Mounting Position: Any
Weight: 0.0046 ounce, 0.116 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
1N 1N 1N 1N 1N 1N 1N
Standard recovery time device: 1st band is White SYMBOLS 6478 6479 6480 6481 6482 6483 6484 UNITS
Polarity color bands (2nd Band) Gray Red Orange Yellow Green Blue Violet
* Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts
* Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts
* Maximum average forward rectified current at I(AV) 1.0 Amp
* Peak forward surge current
8.3ms single half sine-wave superimposed IFSM 30.0 Amps
on rated load at TA=75°C (JEDEC Method)
* Maximum instantaneous forward voltage at 1.0A
TA=25°C VF 1.1 Volts
TA=75°C 1.0
* Maximum DC reverse current TA=25°C 10.0
at rated DC blocking voltage TA=125°C
IR
200.0
µA
* Maximum full load reverse current, full cycle
average at TA=75°C
IR(AV) 100.0 µA
* Typical junction capacitance (NOTE 1) CJ 8.0 pF
* Maximum thermal resistance (NOTE 2) RΘJA 50.0
(NOTE 3) RΘJT 20.0
°C/W
* Operating junction and storage temperature range TJ, TSTG -65 to +175 °C
NOTES:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Thermal resistance from junction to terminal, 0.24 x 0.24” (6.0 x 6.0mm) copper pads to each terminal
(3) Thermal resistance from junction to ambient, 0.24 x 0.24” (6.0 x 6.0mm) copper pads to each terminal
* JEDEC Registered Values
4/98
SOLDERABLE ENDS
1st BAND
0.022 (0.56)
0.018 (0.46)
0.205 (5.2)
0.185(4.7)
D1=
0.105
0.095
(2.67)
(2.41)
D2 = D1
+ 0
- 0.008 (0.20)
1st band denotes type and positive end (cathode)
D2
DO-213AB
Dimensions in inches and (millimeters)
*Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
®
P
A
TENTED*
2nd BAND
2nd band denotes voltage type