1N5624GP
器件描述:GLASS PASSIVATED JUNCTION RECTIFIER
文件大小:59.31KB,共2页
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器件资料摘要:
1N5624GP THRU 1N5627GP
GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 200 to 800 Volts Forward Current - 3.0 Amperes
FEATURES
♦ Plastic package has
Underwriters Laboratory
Flammability Classification 94V-0
♦ High temperature metallurgically
bonded construction
♦ Glass passivated cavity-free junction
♦ Capable of meeting environmental standards of
MIL-S-19500
♦ 3.0 Ampere operation at TA=70°C with no thermal
runaway
♦ Typical IR less than 0.1µA
♦ High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-201AD molded plastic over glass body
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.04 ounce, 1.12 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
.
SYMBOLS 1N5624GP 1N5625GP 1N5626GP 1N5627GP UNITS
* Maximum repetitive peak reverse voltage VRRM 200 400 600 800 Volts
* Maximum DC blocking voltage VDC 200 400 600 800 Volts
* Maximum average forward rectified current
0.375" (9.5mm) lead lengths at TA=70°C
I(AV) 3.0 Amps
* Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM 125.0 Amps
* Maximum instantaneous forward voltage at 3.0A TA=25°C 1.0
TA=70°C
VF
0.95
Volts
Maximum reverse current TA=25°C 5.0
at rated DC blocking voltage TA=150°C
IR
300.0 200.0
µA
Maximum full load reverse current, full cycle
average, 0.375" (9.5mm) lead length at TA=70°C
IR(AV) 200.0 µA
Typical reverse recovery time (NOTE 1) trr 3.0 µs
Typical junction capacitance (NOTE 2) CJ 40.0 pF
Typical thermal resistance (NOTE 3) RΘJA 20.0 °C/W
Operating junction and storage temperature range TJ, TSTG -65 to +175 °C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 VDC
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
*JEDEC Values
4/98
0.210 (5.3)
0.190 (4.8)
DIA.
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
MIN.
DO-201AD
Dimensions in inches and (millimeters)
*Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
P
A
TENTED*
®