1N5550
器件描述：GLASS PASSIVATED JUNCTION RECTIFIER
器件厂商：GE [General Semiconductor]
文件大小：53.13KB，共2页
Sponsor by e络盟器件资料摘要：
1N5550 THRU 1N5552
GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 200 to 1000 Volts Forward Current - 3.0 Amperes
FEATURES
♦ Glass passivated cavity-free junction
♦ High temperature metallurgically bonded construction
♦ Hermetically sealed package
♦ Capable of meeting
environmental
standards of
MIL-S-19500
♦ Medium switching for
improved efficiency
♦ High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Solid glass body
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.037 ounce, 1.04 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS 1N5550 1N5551 1N5552 UNITS
*Maximum repetitive peak reverse voltage VRRM 200 400 600 Volts
Maximum RMS voltage VRMS 140 280 420 Volts
*Maximum DC blocking voltage VDC 200 400 600 Volts
*Minimum reverse breakdown voltage at 50µAV(BR) 240 460 660 Volts
*Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55°C
I(AV) 3.0 Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM 100.0 Amps
Maximum instantaneous forward voltage at 9.0A VF 1.2 Volts
*Maximum DC reverse current TA=25°C 1.0
at rated DC blocking voltage TA=100°C IR 25.0 µA
TA=200°C 1500.0
*Maximum junction capacitance (NOTE 1)CJ150 120 100 pF
*Maximum reverse recovery time (NOTE 2) trr 2.0 µs
Typical thermal resistance (NOTE 3)RΘJA 22.0
°C/W
RΘJL 12.0
*Operating and storage temperature range TJ, TSTG -65 to +200 °C
NOTES:
(1) Measured at 1.0 MHZ and applied reverse voltage of 12.0 Volts
(2) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375” (9.5mm) lead length,
with both leads mounted between heat sinks.
*JEDEC registered values
4/98
P
A
TENTED*
0.180 (4.6)
0.115 (2.9)
0.042 (1.07)
0.038 (0.962)
DIA.
DIA.
MAX.
0.300 (7.6)
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
Case Style G4
Dimensions in inches and (millimeters)
*Brazed-lead assembly is covered by Patent No. 3,930,306
GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 200 to 1000 Volts Forward Current - 3.0 Amperes
FEATURES
♦ Glass passivated cavity-free junction
♦ High temperature metallurgically bonded construction
♦ Hermetically sealed package
♦ Capable of meeting
environmental
standards of
MIL-S-19500
♦ Medium switching for
improved efficiency
♦ High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Solid glass body
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.037 ounce, 1.04 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS 1N5550 1N5551 1N5552 UNITS
*Maximum repetitive peak reverse voltage VRRM 200 400 600 Volts
Maximum RMS voltage VRMS 140 280 420 Volts
*Maximum DC blocking voltage VDC 200 400 600 Volts
*Minimum reverse breakdown voltage at 50µAV(BR) 240 460 660 Volts
*Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55°C
I(AV) 3.0 Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM 100.0 Amps
Maximum instantaneous forward voltage at 9.0A VF 1.2 Volts
*Maximum DC reverse current TA=25°C 1.0
at rated DC blocking voltage TA=100°C IR 25.0 µA
TA=200°C 1500.0
*Maximum junction capacitance (NOTE 1)CJ150 120 100 pF
*Maximum reverse recovery time (NOTE 2) trr 2.0 µs
Typical thermal resistance (NOTE 3)RΘJA 22.0
°C/W
RΘJL 12.0
*Operating and storage temperature range TJ, TSTG -65 to +200 °C
NOTES:
(1) Measured at 1.0 MHZ and applied reverse voltage of 12.0 Volts
(2) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375” (9.5mm) lead length,
with both leads mounted between heat sinks.
*JEDEC registered values
4/98
P
A
TENTED*
0.180 (4.6)
0.115 (2.9)
0.042 (1.07)
0.038 (0.962)
DIA.
DIA.
MAX.
0.300 (7.6)
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
Case Style G4
Dimensions in inches and (millimeters)
*Brazed-lead assembly is covered by Patent No. 3,930,306