1N5059GP THRU 1N5062GP
GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 200 to 800 Volts Forward Current - 1.0 Ampere
FEATURES
♦ Plastic package has
Underwriters Laboratory
Flammability Classification 94V-0
♦ High temperature metallurgically
bonded construction
♦ Glass passivated cavity-free junction
♦ Capable of meeting environmental standards of
MIL-S-19500
♦ 1.0 Ampere operation at TA=75°C with no thermal
runaway
♦ Typical IR less than 0.1µA
♦ High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length at 5 lbs.,
(2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-204AC molded plastic over glass body
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.015 ounce, 0.4 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS 1N5059GP 1N5060GP 1N5061GP 1N5062GP UNITS
* Maximum repetitive peak reverse voltage VRRM 200 400 600 800 Volts
Maximum RMS voltage VRMS 140 280 420 560 Volts
* Maximum DC blocking voltage VDC 200 400 600 800 Volts
* Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=75°C
I(AV) 1.0 Amp
* Peak forward surge current
8.3ms single half sine-wave superimposed IFSM 50.0 Amps
on rated load (JEDEC Method)
* Maximum instantaneous forward voltage at 1.0A, TA=75°C VF 1.2 Volts
* Maximum full load reverse current, full cycle
average 0.375" (9.5mm) lead length at TA=25°C IR(AV)
5.0
µA
TA=75°C
150.0
* Maximum DC reverse current TA= 25°C 5.0
at rated DC blocking voltage TA=175°C
IR
300.0
µA
Typical reverse recovery time (NOTE 1)trr 2.0 µs
Typical junction capacitance (NOTE 2) CJ 15.0 pF
Typical thermal resistance (NOTE 3) RΘJA 45.0
°C/W
RΘJL 20.0
Operating junction and storage temperature range TJ, TSTG -65 to +175 °C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 VDC
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length, P.C.B. mounted
* JEDEC registered value
4/98
0.034 (0.86)
0.028 (0.71)
0.140 (3.6)
0.104 (2.6)
DIA.
DIA.
1.0
MIN.
(25.4)
0.230 (5.8)
0.300 (7.6)
1.0
MIN.
(25.4)
DO-204AC
Dimensions in inches and (millimeters)
*Glass -plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
P
A
TENTED*
®