BAT54H

Surface Mount Schottky
Barrier Diode
Case: Molded Plastic
Polarity: See Diagrams Below
Mounting Position : Any
Low Forward Voltage : 0.35 Volts (Typ) @ IF = 10 mAdc
Shipping : 3000 / Tape & Reel


Low Turn-on Voltage
Extremely Fast Switching Speed
PN Junction Guard Ring for Transient and
ESD Protection



PACKAGE DIMENSIONS
SOD-323
PLASTIC PACKAGE






NOTE 3
A
K
1 2D B
E
H
C
J
1
CATHODE
2
ANODE

1
2
PIN 1. CATHODE
2. ANODE
BA T54 H M arking : JV
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: MILLIMETERS.
3.LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 1.60 1.80 0.063 0.071
B 1.15 1.35 0.045 0.053
C 0.80 1.00 0.031 0.039
D 0.25 0.40 0.010 0.016
E 0.15 REF 0.006 REF
H 0.00 0.10 0.000 0.004
J 0.089 0.177 0.0035 0.0070
K 2.30 2.70 0.091 0.106
MAXIMUM R ATING S (T
J
= 125 5C unless otherwise noted)
Symbol Rating Value Unit
V
R
Reverse Voltage 30 V
THERMAL CHARACTERISTICS
Symbol Characteristic Max Unit
P
D
Total Device Dissipation FR –5 Board,*
T
A
= 25
Derate above 25
200
1.57
mW
mW/
R
JA
Thermal Resistance Junction to Ambient 635
T
J
, T
stg
Junction and Storage Temperature 150
*FR –4 FR-4Minimum Pad
ELECTRICAL CHARACTERISTICS (T
A
= 25 unless otherwise noted)
Characteristic Symbol Min Ty p Max Unit
Reverse Breakdown Voltage (I
R
= 10 A) V
(BR)R
30 Volts
Total Capacitance (V
R
= 1.0 V, f = 1.0 MHz) C
T
7.6 10 pF
Reverse Leakage (V
R
= 25 V) I
R
0.5 2.0 Adc
Forward Voltage (I
F
= 0.1 mAdc) V
F
0.22 0.24 Vdc
Forward Voltage (I
F
= 30 mAdc) V
F
0.41 0.5 Vdc
Forward Voltage (I
F
= 100 mAdc) V
F
0.52 1.0 Vdc
Reverse Recovery Time
(I
F
= I
R
= 10 mAdc, I
R(REC)
= 1.0 mAdc) Figure 1
t
rr
5.0 ns
Forward Voltage (I
F
= 1.0 mAdc) V
F
0.29 0.32 Vdc
Forward Voltage (I
F
= 10 mAdc) V
F
0.35 0.40 Vdc
Forward Current (DC) I
F
200 mAdc
Repetitive Peak Forward Current I
FRM
300 mAdc
Non-RepetitivePeak Forward Current (t < 1.0 s) I
FSM
600 mAdc
o
C
o
C
O
C/W
o
C
o
C
o
C
Features
Mechanical Data