2XP9/210
器件描述：Heatsink For capsule devices
器件厂商：SEMIKRON [Semikron International]
文件大小：628.51KB，共3页
Sponsor by e络盟器件资料摘要：
Heatsink
For capsule devices
P 9
Features
! " # #
$ ! % & ' ' ( !
) ! * ) ! * +
, - . ! , / ' ( ( 0 , ' 1 , / 2 3 ( ' ' * 4 ' 1 ' & 2 5 1 ,
6 5 0 , ' 1 , / 2 3 ( ' ' * 4 ' 1 ' 2 (
. ! 6 ( ' ( ( 0 , ' 1 ' / & 1
7 , - . ! , / ' 6 5 0 , ' 1 ' & ,
Dimensions in mm
. 3 % / 1 5 + ! 4
Dimensions in mm
.
P 9
1 17-03-2005 ADR © by SEMIKRON
For capsule devices
P 9
Features
! " # #
$ ! % & ' ' ( !
) ! * ) ! * +
, - . ! , / ' ( ( 0 , ' 1 , / 2 3 ( ' ' * 4 ' 1 ' & 2 5 1 ,
6 5 0 , ' 1 , / 2 3 ( ' ' * 4 ' 1 ' 2 (
. ! 6 ( ' ( ( 0 , ' 1 ' / & 1
7 , - . ! , / ' 6 5 0 , ' 1 ' & ,
Dimensions in mm
. 3 % / 1 5 + ! 4
Dimensions in mm
.
P 9
1 17-03-2005 ADR © by SEMIKRON