© 2005 Fairchild Semiconductor Corporation DS012025 www.fairchildsemi.com
March 1999
Revised June 2005
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• 74L
VTH16240 Low
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74LVT16240 74LVTH16240
Low Voltage 16-Bit Inverting Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT16240 and LVTH16240 contain sixteen inverting
buffers with 3-STATE outputs designed to be employed as
a memory and address driver, clock driver, or bus-oriented
transmitter/receiver. The device is nibble controlled.
Individual 3-STATE control inputs can be shorted together
for 8-bit or 16-bit operation.
The LVTH16240 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) V
CC
applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT16240 and
LVTH16240 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Features
a73 Input and output interface capability to systems at
5V V
CC
a73 Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16240),
also available without bushold feature (74LVT16240)
a73 Live insertion/extraction permitted
a73 Power Up/Down high impedance provides glitch-free
bus loading
a73 Outputs source/sink c1632 mA/c1464 mA
a73 Functionally compatible with the 74 series 16240
a73 Latch-up performance exceeds 500 mA
a73 ESD performance:
Human-body model c33 2000V
Machine model c33 200V
Charged-device model c33 1000V

Ordering Code:
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package
Number
Package Description
74LVT16240MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16240MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16240MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16240MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide