vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048K030T21 Rev. 1.0
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V•I Chip Bus Converter Module
PRELIMINARY
Parameter Values Unit Notes
+In to -In -1.0 to 60 Vdc
+In to -In 100 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc
+Out to -Out -0.5 to 6.0 Vdc
Isolation voltage 2,250 Vdc Input to Output
Output current 70 A Continuous
Peak output current 105 A For 1 ms
Output power 210 W Continuous
Peak output power 315 W For 1 ms
Case temperature 208 °C During reflow
Operating junction temperature
(1)
-40 to 125 °C T - Grade
-55 to 125 °C M - Grade
Storage temperature -40 to 150 °C T - Grade
-65 to 150 °C M - Grade
•48V to 3 V V•I Chip Converter
• 210 Watt (315 Watt for 1 ms)
•High density – 284 A/in
3
• Small footprint – 60 A/in
2
• Low weight – 0.5 oz (14 g)
• ZVS/ZCS isolated sine
amplitude converter
•94% efficiency
• 125°C operation
• <1 µs transient response
• 3.5 million hours MTBF
•No output filtering required
• Surface mount BGA or J-Lead
packages
B048K030T21
Vin = 38 - 55 V
Vout = 2.38 - 3.43 V
Iout = 70 A
K = 1/16
Rout = 2.0 mΩ max
Actual size
©
V•I Chip
TM
– BCM
Bus Converter Module
BCM
Output Power
Designator
(=POUT/10)
B 048 K 030 T 21
Bus Converter
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade Storage Operating
T-40 to150 -40 to125
M-65 to150 -55 to125
Configuration Options
F=Onboard (Figure 20)
K=Inboard (Figure 19)
Output Voltage
Designator
(=VOUT x10)
Part Numbering
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Product Description
The V•I Chip Bus Converter Module (BCM) is a high
efficiency (>94%), narrow input range Sine Amplitude
Converter (SAC) operating from a 38 to 55 Vdc primary
bus to deliver an isolated 2.38 V to 3.43 V secondary.
The BCM may be used to power non-isolated POL
converters or as an independent 2.38 – 3.43 V source.
Due to the fast response time and low noise of the
BCM, the need for limited life aluminum electrolytic or
tantalum capacitors at the input of POL converters is
reduced—or eliminated—resulting in savings of board
area, materials and total system cost.
The BCM achieves a current density of 284 A/in
3
and
may be surface mounted with a profile as low as 0.16"
(4 mm) over the PCB. Its V•I Chip power package is
compatible with onboard or inboard surface mounting.
The V•I Chip package provides flexible thermal
management through its low Junction-to-Case and
Junction-to-BGA thermal resistance. Owing to its high
conversion efficiency and safe operating temperature
range, the BCM does not require a discrete heat sink in
typical applications. It is also available with heat sink
options, assuring low junction temperatures and long
life in the harshest environments.
Absolute Maximum Ratings