21-0056C
器件描述:PACKAGE OUTLINE, SSOP, 5.3 MM
文件大小:17.45KB,共1页
Sponsor by e络盟
器件资料摘要:
PACKAGE OUTLINE, SSOP, 5.3 MM
1
1
21-0056
C REV.
DOCUMENT CONTROL NO.
APPROVAL PROPRIETARY INFORMATIONTITLE:
NOTES:1. D&E DO NOT INCLUDE MOLD FLASH.2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").3. CONTROLLING DIMENSION: MILLIMETERS.4. MEETS JEDEC MO150.5. LEADS TO BE COPLANAR WITHIN 0.10 MM.
7.90
HL
0°
0.3010.025
8°
0.3110.037
0°
7.650.63
8° 0.95 MAX5.38
MILLIMETERS
BCDEe A1 DIMA
SEE VARIATIONS
0.0256 BSC 0.0100.0040.205 0.002
0.0150.0080.212 0.008
INCHESMIN
MAX0.078
0.65 BSC 0.250.095.20 0.05
0.380.20 0.21
MIN1.73
1.99
MILLIMETERS6.076.0710.07 8.07 7.07
INCHES
DDD D D
0.2390.2390.397 0.317 0.278 MIN
0.2490.2490.407 0.328 0.289 MAX
MIN
6.336.3310.33 8.33 7.33
14L16L28L 24L 20L
MAX
N
A
D
e
A1
L
C
H
E
N 1
2
B
0.068