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厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

74ALVTH162827GRE4

器件描述:2.5-V/3.3-V 20-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
器件厂商:TI [Texas Instruments]
厂商主页:http://www.ti.com/
文件大小:265.22KB,共14页
Sponsor by e络盟
器件资料摘要:
SN54ALVTH162827, SN74ALVTH162827
2.5-V/3.3-V 20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS

SCES079E – JULY 1996 – REVISED DECEMBER 1998
1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
C0068 State-of-the-Art Advanced BiCMOS
Technology (ABT) Widebus Design for
2.5-V and 3.3-V Operation and Low Static
Power Dissipation
C0068 Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V V
CC
)
C0068 Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
C0068 Power Off Disables Outputs, Permitting
Live Insertion
C0068 High-Impedance State During Power Up
and Power Down Prevents Driver Conflict
C0068 Uses Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
C0068 Output Ports Have Equivalent 30-Ω Series
Resistors, So No External Resistors Are
Required
C0068 Auto3-State Eliminates Bus Current
Loading When Output Exceeds V
CC
+ 0.5 V
C0068 Latch-Up Performance Exceeds 250 mA Per
JESD 17
C0068 ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model; and Exceeds 1000 V
Using Charged-Device Model, Robotic
Method
C0068 Flow-Through Architecture Facilitates
Printed Circuit Board Layout
C0068 Distributed V
CC
and GND Pin Configuration
Minimizes High-Speed Switching Noise
C0068 Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
NOTE: For order entry:
The DGG package is abbreviated to G, and
the DGV package is abbreviated to V.
description
The ’ALVTH162827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V V
CC
operation, but with
the capability to provide a TTL interface to a 5-V system environment.
Copyright  1998, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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1OE1
1Y1
1Y2
GND
1Y3
1Y4
V
CC
1Y5
1Y6
1Y7
GND
1Y8
1Y9
1Y10
2Y1
2Y2
2Y3
GND
2Y4
2Y5
2Y6
V
CC
2Y7
2Y8
GND
2Y9
2Y10
2OE1
1OE2
1A1
1A2
GND
1A3
1A4
V
CC
1A5
1A6
1A7
GND
1A8
1A9
1A10
2A1
2A2
2A3
GND
2A4
2A5
2A6
V
CC
2A7
2A8
GND
2A9
2A10
2OE2
SN54ALVTH162827 . . . WD PACKAGE
SN74ALVTH162827 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Widebus is a trademark of Texas Instruments Incorporated.