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厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

1N5550

器件描述:This specification covers the performance requirements for silicon, general purpose,
器件厂商:ETC [ETC]
厂商主页:
文件大小:202.03KB,共28页
Sponsor by e络盟
器件资料摘要:
MIL-PRF-19500/420H
19 April 2004
SUPERSEDING
MIL-PRF-19500/420G
30 December 2002

PERFORMANCE SPECIFICATION SHEET

* SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER, RECTIFIER,
TYPES 1N5550 THROUGH 1N5554, 1N5550US THROUGH 1N5554US,
JAN, JANTX, JANTXV, JANS, JANHCA, JANHCB, JANHCC, JANHCD,
JANHCE, JANKCA, JANKCD, AND JANKCE

This specification is approved for use by all Departments
and Agencies of the Department of Defense.

* The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.

1. SCOPE

* 1.1 Scope. This specification covers the performance requirements for silicon, general purpose, semiconductor
diodes. Four levels of product assurance are provided for each encapsulated device type as specified in
MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type.

1.2 Physical dimensions. See figure 1 (similar to DO-41) for 1N5550 through 1N5554, figure 2 for 1N5550US
through 1N5554US, and figures 3, 4, 5, 6, and 7 for JANHC and JANKC die.

1.3 Maximum ratings. Unless otherwise specified, T
C
= +25°C and ratings apply to all case outlines.

Col. 1
Col. 2
Col. 3 Col. 4 Col. 5 Col. 6 Col. 7 Col. 8

Type

V
(BR)

V
RWM

and
V
(BR)min



I
O1

T
L
= +55°C;
L = .375 inch
(1) (2) (3)


I
FSM

I
O
= 2 A dc
t
p
= 1/120 s
T
A
= +55°C


T
J


I
O2

T
A
=
+55°C
(2) (4)


T
STG




1N5550, 1N5550US
1N5551, 1N5551US
1N5552, 1N5552US
1N5553, 1N5553US
1N5554, 1N5554US



200
400
600
800
1,000

V dc

200
400
600
800
1,000

A dc

5
5
5
5
5

A(pk)

100
100
100
100
100

°C

-65 to +200
-65 to +200
-65 to +200
-65 to +200
-65 to +200

A dc

3
3
3
3
3

°C

-65 to +175
-65 to +175
-65 to +175
-65 to +175
-65 to +175
(1) Derate linearly at 41.6 mA/°C above T
L
= +55°C at L = .375 inch (9.53 mm).
(2) An I
O
of up to 6 A dc is allowable provided that appropriate heat sinking or forced air cooling maintains the
maximum junction temperature at or below +200°C as proven by the junction temperature rise test (see 6.5).
Barometric pressure reduced:
1N5550, 1N5551, 1N5552 - 8 mmHg (100,000 feet).
1N5553, 1N5554 - 33 mmHg (70,000 feet).
(3) Does not apply to surface mount devices.
(4) Derate linearly at 25 mA/°C above T
A
= +55°C.






AMSC N/A FSC 5961
INCH-POUND The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 19 July 2004.
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43216-5000, or emailed to
Semiconduction@dscc.dla.mil . Since contact information can change, you may want to verify the currency of
this address information using the ASSIST Online database at http://www.dodssp.daps.mil.