523
器件资料摘要：
050304 WebSite www.littelfuse.com
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
MINIATURE FUSEHOLDERS
Note: 1.00 means the number one with two decimal places. 1,000 means the number one thousand.
Order- Qty. Order- Series Packaging
Information Number 523 0000 S00
No. 523 / PIPclip
Specifications
Packaging
S00 blister tape (1x800 pcs.)
reel diameter 380 mm
tape width 16 mm
Mounting
PC Board, 5,2 mm pin spacing
Solder pins 0.4 x 1.2 mm
Materials
copper alloy, solderable tinned
Electrical Data (23 ºC)
Rated Voltage: 250 V
Max. Current/Power: 6.3 A/2.5 W
Minimum Cross Section
Conducting path - 0.2 mm
2
Solderability
235 °C, 2 s (IEC 60068-2-20)
Soldering Heat Resistance
260 ºC, 10 s (IEC 60068-2-20)
Unit Weight
0.4 g
Example for PC Board
Specifications are subject
to change without notice
lead free
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
MINIATURE FUSEHOLDERS
Note: 1.00 means the number one with two decimal places. 1,000 means the number one thousand.
Order- Qty. Order- Series Packaging
Information Number 523 0000 S00
No. 523 / PIPclip
Specifications
Packaging
S00 blister tape (1x800 pcs.)
reel diameter 380 mm
tape width 16 mm
Mounting
PC Board, 5,2 mm pin spacing
Solder pins 0.4 x 1.2 mm
Materials
copper alloy, solderable tinned
Electrical Data (23 ºC)
Rated Voltage: 250 V
Max. Current/Power: 6.3 A/2.5 W
Minimum Cross Section
Conducting path - 0.2 mm
2
Solderability
235 °C, 2 s (IEC 60068-2-20)
Soldering Heat Resistance
260 ºC, 10 s (IEC 60068-2-20)
Unit Weight
0.4 g
Example for PC Board
Specifications are subject
to change without notice
lead free