74VCX16245G
器件描述：Low Voltage 16-Bit Bidirectional Transceiver with 3.6V Tolerant Inputs and Outputs
器件厂商：FAIRCHILD [Fairchild Semiconductor]
文件大小：138.97KB，共9页
Sponsor by e络盟器件资料摘要：
© 2005 Fairchild Semiconductor Corporation DS012169 www.fairchildsemi.com
October 1996
Revised June 2005
7
4
VC
X16
245
Lo
w
V
o
lt
age 16-
Bit
Bi
dir
ecti
onal
T
r
anscei
ver wit
h
3.
6V
T
o
l
e
ran
t
Input
s and Output
s
74VCX16245
Low Voltage 16-Bit Bidirectional Transceiver
with 3.6V Tolerant Inputs and Outputs
General Description
The VCX16245 contains sixteen non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. Each
byte has separate 3-STATE control inputs which can be
shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The 74VCX16245 is designed for low voltage (1.2V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74VCX16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
a73 1.2V to 3.6V V
CC
supply operation
a73 3.6V tolerant inputs and outputs
a73 t
PD
2.5 ns max for 3.0V to 3.6V V
CC
a73 Power-off high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 Static Drive (I
OH
/I
OL
)
c11424 mA @ 3.0V V
CC
a73 Uses patented noise/EMI reduction circuitry
a73 Latchup performance exceeds 300 mA
a73 ESD performance:
Human body model c33 2000V
Machine model c33200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74VCX16245G
(Note 2)(Note 3)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74VCX16245MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
October 1996
Revised June 2005
7
4
VC
X16
245
Lo
w
V
o
lt
age 16-
Bit
Bi
dir
ecti
onal
T
r
anscei
ver wit
h
3.
6V
T
o
l
e
ran
t
Input
s and Output
s
74VCX16245
Low Voltage 16-Bit Bidirectional Transceiver
with 3.6V Tolerant Inputs and Outputs
General Description
The VCX16245 contains sixteen non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. Each
byte has separate 3-STATE control inputs which can be
shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The 74VCX16245 is designed for low voltage (1.2V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74VCX16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
a73 1.2V to 3.6V V
CC
supply operation
a73 3.6V tolerant inputs and outputs
a73 t
PD
2.5 ns max for 3.0V to 3.6V V
CC
a73 Power-off high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 Static Drive (I
OH
/I
OL
)
c11424 mA @ 3.0V V
CC
a73 Uses patented noise/EMI reduction circuitry
a73 Latchup performance exceeds 300 mA
a73 ESD performance:
Human body model c33 2000V
Machine model c33200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74VCX16245G
(Note 2)(Note 3)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74VCX16245MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide