12/2002
AWT6113
PCS/CDMA 3.4V/28dBm
Linear Power Amplifier Module
PRELIMINARY DATA SHEET - Rev 1.4
M7 Package
10 Pin 4mm x 4mm
Surface Mount Module
FEATURES
• InGaP HBT Technology
High Efficiency: 38%
Low Quiescent Current: 44 mA
Low Leakage Current in Shutdown Mode: <1 µA
Optimized for a 50 Ω System
Low Profile Surface Mount Package: 1.56mm max
CDMA 1XRTT Compliant
CDMA 1xEV-DO Compliant
APPLICATIONS
PCS CDMA Wireless Handsets
Dual Band CDMA Wireless Handsets
PRODUCT DESCRIPTION
The AWT6113 is a high power, high efficiency
amplifier module for PCS/CDMA wireless handset
applications. The device is manufactured on an
advanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. Selectable bias modes that optimize
efficiency for different output power levels, and
a shutdown mode with low leakage current, serve to
increase handset talk and standby time. The
self-contained 4mm x 4mm surface mount package
incorporates matching networks optimized for output
power, efficiency and linearity in a 50 Ω system.
Figure 1: Block Diagram
Bias Control
VCC
VREF
RFIN
RFOUT
GND
VMODE
1
7
5
8
10
6
GND at slug (pad)
3
9
4
2
GND
VCC
GND
GND