74LCX07BQX
器件描述：Low Voltage Hex Buffer with Open Drain Outputs
器件厂商：FAIRCHILD [Fairchild Semiconductor]
文件大小：69.71KB，共10页
Sponsor by e络盟器件资料摘要：
© 2005 Fairchild Semiconductor Corporation DS500238 www.fairchildsemi.com
October 1999
Revised February 2005
7
4LCX07
Low V
o
l
t
age Hex
Buf
f
e
r
w
i
th Open
Dr
ain Output
s
74LCX07
Low Voltage Hex Buffer with Open Drain Outputs
General Description
The LCX07 contains six buffers. The inputs tolerate volt-
ages up to 7V allowing the interface of 5V systems to 3V
systems.
The outputs of the LCX07 are open drain and can be con-
nected to other open drain outputs to implement active
HIGH wire AND or active LOW wire OR functions.
The 74LCX07 is fabricated with advanced CMOS technol-
ogy to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
a73 5V tolerant inputs
a73 2.3V to 5.5V V
CC
specifications provided
a73 2.9 ns t
PD
max (V
CC
c32 3.3V), 10 c80A I
CC
max
a73 Power down high impedance inputs and outputs
a73 c1424 mA output drive (V
CC
c32 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance exceeds JEDEC 78 conditions
a73 ESD performance:
Human body model c33 2000V
Machine model c33 200V
a73 Leadless Pb-Free DQFN package
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Note 2: DQFN package available in Tape and Reel only.
Order Number
Package
Package Description
Number
74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07MX_NL
(Note 1)
M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX07BQX
(Note 2)
MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX07MTCX_NL
(Note 1)
MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
October 1999
Revised February 2005
7
4LCX07
Low V
o
l
t
age Hex
Buf
f
e
r
w
i
th Open
Dr
ain Output
s
74LCX07
Low Voltage Hex Buffer with Open Drain Outputs
General Description
The LCX07 contains six buffers. The inputs tolerate volt-
ages up to 7V allowing the interface of 5V systems to 3V
systems.
The outputs of the LCX07 are open drain and can be con-
nected to other open drain outputs to implement active
HIGH wire AND or active LOW wire OR functions.
The 74LCX07 is fabricated with advanced CMOS technol-
ogy to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
a73 5V tolerant inputs
a73 2.3V to 5.5V V
CC
specifications provided
a73 2.9 ns t
PD
max (V
CC
c32 3.3V), 10 c80A I
CC
max
a73 Power down high impedance inputs and outputs
a73 c1424 mA output drive (V
CC
c32 3.0V)
a73 Implements patented noise/EMI reduction circuitry
a73 Latch-up performance exceeds JEDEC 78 conditions
a73 ESD performance:
Human body model c33 2000V
Machine model c33 200V
a73 Leadless Pb-Free DQFN package
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Note 2: DQFN package available in Tape and Reel only.
Order Number
Package
Package Description
Number
74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07MX_NL
(Note 1)
M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX07BQX
(Note 2)
MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX07MTCX_NL
(Note 1)
MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide