BC-148
器件描述：148-Lead Chip Scale Package Ball Grid Array
器件厂商：AD [Analog Devices]
文件大小：276.76KB，共1页
Sponsor by e络盟器件资料摘要：
a
148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-148)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION
TO DIMENSIONS INDICATED BY AN ASTERISK.
B
C
D
E
F
G
H
J
K
A
SEATING
PLANE
0.15 MIN
DETAIL A
0.35
0.30
0.25
BALL DIAMETER
COPLANARITY
0.08
0.50 BSC
7.50
BSC SQ
10
9
8
7
6
5
4
3
2
1
A1 CORNER
INDEX AREA
TOP VIEW
BALL A1
PAD CORNER
DETAIL A
*
1.40 MAX
*
1.11 MAX
11
12
L
M
13
14
15
16
N
P
R
T
9.10
9.00 SQ
8.90
148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-148)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION
TO DIMENSIONS INDICATED BY AN ASTERISK.
B
C
D
E
F
G
H
J
K
A
SEATING
PLANE
0.15 MIN
DETAIL A
0.35
0.30
0.25
BALL DIAMETER
COPLANARITY
0.08
0.50 BSC
7.50
BSC SQ
10
9
8
7
6
5
4
3
2
1
A1 CORNER
INDEX AREA
TOP VIEW
BALL A1
PAD CORNER
DETAIL A
*
1.40 MAX
*
1.11 MAX
11
12
L
M
13
14
15
16
N
P
R
T
9.10
9.00 SQ
8.90