28F200BX
器件描述：2-MBIT (128K x 16, 256K x 8) BOOT BLOCK FLASH MEMORY FAMILY
器件厂商：INTEL [Intel Corporation]
文件大小：562.82KB，共48页
Sponsor by e络盟器件资料摘要：
*Other brands and names are the property of their respective owners.
Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or
copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make
changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.
November 1995COPYRIGHT ' INTEL CORPORATION, 1995 Order Number: 290448-005
2-MBIT (128K x 16, 256K x 8)
BOOT BLOCK
FLASH MEMORY FAMILY
28F200BX-T/B, 28F002BX-T/B
Y
x8/x16 Input/Output Architecture
— 28F200BX-T, 28F200BX-B
— For High Performance and High
Integration 16-bit and 32-bit CPUs
Y
x8-only Input/Output Architecture
— 28F002BX-T 28F002BX-B
— For Space Constrained 8-bit
Applications
Y
Upgradeable to Intel’s SmartVoltage
Products
Y
Optimized High-Density Blocked
Architecture
— One 16-KB Protected Boot Block
— Two 8-KB Parameter Blocks
— One 96-KB Main Block
— One 128 KB Main Block
— Top or Bottom Boot Locations
Y
Extended Cycling Capability
— 100,000 Block Erase Cycles
Y
Automated Word/Byte Write and
Block Erase
— Command User Interface
— Status Registers
— Erase Suspend Capability
Y
SRAM-Compatible Write Interface
Y
Automatic Power Savings Feature
— 1 mA Typical I
CC
Active Current in
Static Operation
Y
Hardware Data Protection Feature
— Erase/Write Lockout during Power
Transitions
Y
Very High-Performance Read
— 60/80/120 ns Maximum Access Time
— 30/40/40 ns Maximum Output Enable
Time
Y
Low Power Consumption
— 20 mA Typical Active Read Current
Y
Reset/Deep Power-Down Input
— 0.2 mAI
CC
Typical
— Acts as Reset for Boot Operations
Y
Extended Temperature Operation
—
b
40§Cto
a
85§C
Y
Write Protection for Boot Block
Y
Industry Standard Surface Mount
Packaging
— 28F200BX: JEDEC ROM Compatible
44-Lead PSOP
56-Lead TSOP
— 28F002BX: 40-Lead TSOP
Y
12V Word/Byte Write and Block Erase
—V
PP
e
12V g5% Standard
—V
PP
e
12V g10% Option
Y
ETOX
TM
III Flash Technology
— 5V Read
Y
Independent Software Vendor Support
Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or
copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make
changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.
November 1995COPYRIGHT ' INTEL CORPORATION, 1995 Order Number: 290448-005
2-MBIT (128K x 16, 256K x 8)
BOOT BLOCK
FLASH MEMORY FAMILY
28F200BX-T/B, 28F002BX-T/B
Y
x8/x16 Input/Output Architecture
— 28F200BX-T, 28F200BX-B
— For High Performance and High
Integration 16-bit and 32-bit CPUs
Y
x8-only Input/Output Architecture
— 28F002BX-T 28F002BX-B
— For Space Constrained 8-bit
Applications
Y
Upgradeable to Intel’s SmartVoltage
Products
Y
Optimized High-Density Blocked
Architecture
— One 16-KB Protected Boot Block
— Two 8-KB Parameter Blocks
— One 96-KB Main Block
— One 128 KB Main Block
— Top or Bottom Boot Locations
Y
Extended Cycling Capability
— 100,000 Block Erase Cycles
Y
Automated Word/Byte Write and
Block Erase
— Command User Interface
— Status Registers
— Erase Suspend Capability
Y
SRAM-Compatible Write Interface
Y
Automatic Power Savings Feature
— 1 mA Typical I
CC
Active Current in
Static Operation
Y
Hardware Data Protection Feature
— Erase/Write Lockout during Power
Transitions
Y
Very High-Performance Read
— 60/80/120 ns Maximum Access Time
— 30/40/40 ns Maximum Output Enable
Time
Y
Low Power Consumption
— 20 mA Typical Active Read Current
Y
Reset/Deep Power-Down Input
— 0.2 mAI
CC
Typical
— Acts as Reset for Boot Operations
Y
Extended Temperature Operation
—
b
40§Cto
a
85§C
Y
Write Protection for Boot Block
Y
Industry Standard Surface Mount
Packaging
— 28F200BX: JEDEC ROM Compatible
44-Lead PSOP
56-Lead TSOP
— 28F002BX: 40-Lead TSOP
Y
12V Word/Byte Write and Block Erase
—V
PP
e
12V g5% Standard
—V
PP
e
12V g10% Option
Y
ETOX
TM
III Flash Technology
— 5V Read
Y
Independent Software Vendor Support