AGP15
器件描述:
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Sponsor by e络盟
器件资料摘要:
AGP15 Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88535 www.vishay.com
08-Jul-02 1
Miniature Glass Passivated Junction
Plastic Controlled Avalanche Rectifiers
Reverse Voltage
400 to 800V
Forward Current 1.5A
Patented*
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol AGP15-400 AGP15-600 AGP15-800 Unit
Maximum Recurrent Peak Reverse Voltage VRRM 400 600 800 V
Maximum RMS voltage VRMS 280 420 560 V
Maximum DC blocking voltage VDC 400 600 800 V
Maximum Peak Power Dissipation in the
Avalanch Region 20 µs Pulse
PRM 500 W
Max. Average Forward Rectified Current 0.375” (9.5mm)
IAV 1.5 A
Lead Lengths at TA = 55°C
Peak forward surge current 8.3ms single half sine-wave
IFSM 50 A
superimposed on rated load (JEDEC Method)
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length at TA = 55°C
IR(AV) 100 µA
Typical thermal resistance (Note 1) RθJA 25 °C/W
Operating and storage temperature range TJ, TSTG –65 to +175 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Minimum Avalanche Breakdown Voltage at 100µAVBR 450 675 880 V
Maximum Avalanche Breakdown Voltage at 100µ BR 750 1000 1200 V
Maximum instantaneous forward voltage at 1.5A VF 1.1 V
Maximum reverse current at rated DC blocking voltage IR 5.0 µA
Typical reverse recovery time IF=0.5A, IR=1.0A, Irr=0.25A trr 2.0 µs
Typical junction capacitance at 4.0V, 1MHz CJ 15 pF
Note: (1) Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C. Board mounted
DO-204AC
(DO-15)
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• High temp. metallurgically bonded constructed rectifiers
• Controlled Avalanche characteristic combined with the
ability to dissipate reverse power
• Glass passivated cavity-free junction in DO-15 package
• 1.5 Ampere operation at TA=55°C with no thermal runaway
• Typical IR less than 0.1µA
• Capable of meeting environmental standards of MIL-S-19500
• High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: Molded plastic over glass
Terminals: Plated axial leads, solderable per
MIL-STD-202, Method 208
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0154 oz., 0.4 g
0.034 (0.86)
0.028 (0.71)
Dia.
0.140 (3.6)
0.104 (2.6)
Dia.
0.230 (5.8)
0.300 (7.6)
1.0 (25.4)
min.
1.0 (25.4)
min.
®
*Glass-plastic encapsulation
technique is covered by
Patent No. 3,996,602 of 1976;
brazed-lead assembly by
Patent No. 3,930,306 of 1976
and glass composition by
Patent No. 3,752,701 of 1973
Dimensions in inches
and (millimeters)