28F016B3
器件描述：SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
器件厂商：INTEL [Intel Corporation]
文件大小：304.24KB，共48页
Sponsor by e络盟器件资料摘要：
E
PRELIMINARY
July 1998 Order Number: 290580-005
c110 Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
12 V V
PP
Fast Production
Programming
c110 2.7 V or 1.65 V I/O Option
Reduces Overall System Power
c110 High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
c110 Optimized Block Sizes
Eight 8-KB Blocks for Data,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks for
Code
c110 Block Locking
V
CC
-Level Control through WP#
c110 Low Power Consumption
10 mA Typical Read Current
c110 Absolute Hardware-Protection
V
PP
= GND Option
V
CC
Lockout Voltage
c110 Extended Temperature Operation
–40 °C to +85 °C
c110 Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., Voice)
c110 Automated Program and Block Erase
Status Registers
c110 Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles Guaranteed
c110 Automatic Power Savings Feature
Typical I
CCS
after Bus Inactivity
c110 Standard Surface Mount Packaging
48-Ball m BGA* Package
48-Lead TSOP Package
40-Lead TSOP Package
c110 Footprint Upgradeable
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
c110 ETOX™ VI (0.25 m) Flash Technology
The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be
obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.
SMART 3 ADVANCED BOOT BLOCK
4-, 8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3, 28F320B3
28F008B3, 28F016B3, 28F032B3
PRELIMINARY
July 1998 Order Number: 290580-005
c110 Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
12 V V
PP
Fast Production
Programming
c110 2.7 V or 1.65 V I/O Option
Reduces Overall System Power
c110 High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
c110 Optimized Block Sizes
Eight 8-KB Blocks for Data,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks for
Code
c110 Block Locking
V
CC
-Level Control through WP#
c110 Low Power Consumption
10 mA Typical Read Current
c110 Absolute Hardware-Protection
V
PP
= GND Option
V
CC
Lockout Voltage
c110 Extended Temperature Operation
–40 °C to +85 °C
c110 Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., Voice)
c110 Automated Program and Block Erase
Status Registers
c110 Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles Guaranteed
c110 Automatic Power Savings Feature
Typical I
CCS
after Bus Inactivity
c110 Standard Surface Mount Packaging
48-Ball m BGA* Package
48-Lead TSOP Package
40-Lead TSOP Package
c110 Footprint Upgradeable
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
c110 ETOX™ VI (0.25 m) Flash Technology
The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be
obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.
SMART 3 ADVANCED BOOT BLOCK
4-, 8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3, 28F320B3
28F008B3, 28F016B3, 28F032B3