1
2150B–BIOM–09/03
Features
Sensitive Layer Over a 0.8 µm CMOS Array
Image Zone: 0.4 x 14 mm = 0.02" x 0.55"
Image Array: 8 x 280 = 2240 pixels
Pixel Pitch: 50 µm x 50 µm = 500 dpi
Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second
Die Size: 1.7 x 17.3 mm
Operating Voltage: 3 V to 5.5 V
Naturally Protected Against ESD: > 16 kV Air Discharge
Power Consumption: 20 mW at 3.3 V, 1 MHz, 25°C
Operating Temperature Range: -40°C to +85°C
Resistant to Abrasion: >1 Million Finger Sweeps
Chip-on-Board (COB), Chip-on-Board (COB) with Connector, or 20-lead Ceramic DIP
Available for Development, with Specific Protective Layer
Applications
PDA (Access Control, Data Protection)
Cellular Phones, SmartPhones (Access e-business)
Notebook, PC-add on (Access Control, e-business)
PIN Code Replacement
Automated Teller Machines, POS
Building Access
Electronic Keys (Cars, Home,...)
Portable Fingerprint Imaging for Law Enforcement
TV Access
Figure 1. FingerChip
™
Packages
Chip-on-Board Package
(COB)
Chip-on-Board Package
with connector
Actual size
Thermal
Fingerprint
Sensor with
0.4 mm x 14 mm
(0.02" x 0.55")
Sensing Area
and
Digital Output
(On-chip ADC)
AT77C101B
FingerChip
™
Sweep your finger
to make life easier
Rev. 150B–BIOM–09/0