74ALVC16245
器件描述：Low Voltage 16-Bit Bidirectional Transceiver with 3.6V Tolerant Inputs and Outputs
器件厂商：FAIRCHILD [Fairchild Semiconductor]
文件大小：106.27KB，共7页
Sponsor by e络盟器件资料摘要：
© 2002 Fairchild Semiconductor Corporation DS500678 www.fairchildsemi.com
October 2001
Revised August 2002
7
4
AL
VC1624
5 Low
V
o
l
t
a
g
e 16-
Bit
Bi
di
rect
ional
T
r
anscei
ver
wit
h
3
.
6V
T
o
ler
a
nt
Inpu
ts
and Out
puts
74ALVC16245
Low Voltage 16-Bit Bidirectional Transceiver
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16245 contains sixteen non-inverting bidirec-
tional buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is byte controlled. Each
byte has separate 3-STATE control inputs which can be
shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The 74ALVC16245 is designed for low voltage (1.65V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74ALVC16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
a73 1.65V–3.6V V
CC
supply operation
a73 3.6V tolerant inputs and outputs
a73 t
PD
3.0 ns max for 3.0V to 3.6V V
CC
3.5 ns max for 2.3V to 2.7V V
CC
6.0 ns max for 1.65V to 1.95V V
CC
a73 Power-down high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 Uses patented noise/EMI reduction circuitry
a73 Latchup conforms to JEDEC JED78
a73 ESD performance:
Human body model > 2000V
Machine model >200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74ALVC16245G
(Note 2)(Note 3)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74ALVC16245MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
October 2001
Revised August 2002
7
4
AL
VC1624
5 Low
V
o
l
t
a
g
e 16-
Bit
Bi
di
rect
ional
T
r
anscei
ver
wit
h
3
.
6V
T
o
ler
a
nt
Inpu
ts
and Out
puts
74ALVC16245
Low Voltage 16-Bit Bidirectional Transceiver
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16245 contains sixteen non-inverting bidirec-
tional buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is byte controlled. Each
byte has separate 3-STATE control inputs which can be
shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The 74ALVC16245 is designed for low voltage (1.65V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74ALVC16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
a73 1.65V–3.6V V
CC
supply operation
a73 3.6V tolerant inputs and outputs
a73 t
PD
3.0 ns max for 3.0V to 3.6V V
CC
3.5 ns max for 2.3V to 2.7V V
CC
6.0 ns max for 1.65V to 1.95V V
CC
a73 Power-down high impedance inputs and outputs
a73 Supports live insertion/withdrawal (Note 1)
a73 Uses patented noise/EMI reduction circuitry
a73 Latchup conforms to JEDEC JED78
a73 ESD performance:
Human body model > 2000V
Machine model >200V
a73 Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74ALVC16245G
(Note 2)(Note 3)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74ALVC16245MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide