74VHC04
器件资料摘要：
© 2005 Fairchild Semiconductor Corporation DS011516 www.fairchildsemi.com
November 1992
Revised February 2005
7
4
VH
C04
Hex
Inve
rte
r
74VHC04
Hex Inverter
General Description
The VHC04 is an advanced high speed CMOS Inverter
fabricated with silicon gate CMOS technology. It achieves
the high speed operation similar to equivalent Bipolar
Schottky TTL while maintaining the CMOS low power dissi-
pation.
The internal circuit is composed of 3 stages including buffer
output, which provide high noise immunity and stable out-
put. An input protection circuit ensures that 0V to 7V can be
applied to the input pins without regard to the supply volt-
age. This device can be used to interface 5V to 3V systems
and two supply systems such as battery back up. This cir-
cuit prevents device destruction due to mismatched supply
and input voltages.
Features
a73 High Speed: t
PD
c32 3.8 ns (typ) at V
CC
c32 5V
a73 High noise immunity: V
NIH
c32 V
NIL
c32 28% V
CC
(Min)
a73 Power down protection is provided on all inputs
a73 Low Noise: V
OLP
c32 0.4V (typ)
a73 Low power dissipation: I
CC
c32 2 c80A (Max) @ T
A
c32 25c113C
a73 Pin and function compatible with 74HC04
Ordering Code:
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Order Number
Package
Package Description
Number
74VHC04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHC04MX_NL
(Note 1)
M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHC04SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHC04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74VHC04MTCX_NL
(Note 1)
MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74VHC04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
November 1992
Revised February 2005
7
4
VH
C04
Hex
Inve
rte
r
74VHC04
Hex Inverter
General Description
The VHC04 is an advanced high speed CMOS Inverter
fabricated with silicon gate CMOS technology. It achieves
the high speed operation similar to equivalent Bipolar
Schottky TTL while maintaining the CMOS low power dissi-
pation.
The internal circuit is composed of 3 stages including buffer
output, which provide high noise immunity and stable out-
put. An input protection circuit ensures that 0V to 7V can be
applied to the input pins without regard to the supply volt-
age. This device can be used to interface 5V to 3V systems
and two supply systems such as battery back up. This cir-
cuit prevents device destruction due to mismatched supply
and input voltages.
Features
a73 High Speed: t
PD
c32 3.8 ns (typ) at V
CC
c32 5V
a73 High noise immunity: V
NIH
c32 V
NIL
c32 28% V
CC
(Min)
a73 Power down protection is provided on all inputs
a73 Low Noise: V
OLP
c32 0.4V (typ)
a73 Low power dissipation: I
CC
c32 2 c80A (Max) @ T
A
c32 25c113C
a73 Pin and function compatible with 74HC04
Ordering Code:
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Order Number
Package
Package Description
Number
74VHC04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHC04MX_NL
(Note 1)
M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHC04SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHC04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74VHC04MTCX_NL
(Note 1)
MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74VHC04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide