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EMIF06-10006F1®
March 2004 - Ed: 2
Flip-Chip package
®
I4
O4
I1
O1
I6
Gnd Gnd Gnd
O6
I3
O3
I5
O5
I2
O2
987 654 321
A
B
C
PIN CONFIGURATION (ball side)
6 LINES EMI FILTER
AND ESD PROTECTIONIPAD
TM
TM : IPAD is a trademark of STMicroelectronics.
IEC 61000-4-2 level 4:
15kV (air discharge)
8 kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3: 30kV
COMPLIES WITH THE FOLLOWING STANDARDS :
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming:
2.92mm x 1.29mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
(IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging.
BENEFITS
Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones
■ Computers and printers
■ Communication systems
■ MCU Boards
MAIN PRODUCT CHARACTERISTICS
The EMIF06-10006F1 is a highly integrated devices
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The
EMIF06 flip-chip packaging means the package size
is equal to the die size.
This filter includes an ESD protection circuitry which
prevents the device from destruction when subjected
to ESD surges up 15kV. This device includes 6 EMIF
filters.
DESCRIPTION
Output 4Input 1
30pF 30pF
100Ω
Output 1 Input 4
30pF 30pF
100Ω
Output 5Input 5
30pF 30pF
100Ω
Output 6Input 6
30pF 30pF
100Ω
Input 2
30pF 30pF
100Ω
Output 2
Input 3
30pF 30pF
100Ω
Output 3
BASIC CELL CONFIGURATION