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厂商索引:A-B-C-D-E-F-G-H-I-J-K-L-M-N-O-P-Q-R-S-T-U-V-W-X-Y-Z

BUK552-60

器件描述:PowerMOS transistor Logic level FET
器件厂商:PHILIPS [Philips Semiconductors]
文件大小:55.46KB,共7页
Sponsor by e络盟
器件资料摘要:
Philips Semiconductors Product Specification
PowerMOS transistor BUK552-60A/B
Logic level FET
GENERAL DESCRIPTION QUICK REFERENCE DATA
N-channel enhancement mode SYMBOL PARAMETER MAX. MAX. UNIT
logic level field-effect power
transistor in a plastic envelope. BUK552 -60A -60B
The device is intended for use in V
DS
Drain-source voltage 60 60 V
Switched Mode Power Supplies I
D
Drain current (DC) 14 13 A
(SMPS), motor control, welding, P
tot
Total power dissipation 60 60 W
DC/DC and AC/DC converters, and T
j
Junction temperature 175 175 ˚C
in automotive and general purpose R
DS(ON)
Drain-source on-state 0.15 0.18 Ω
switching applications. resistance; V
GS
= 5 V
PINNING - TO220AB PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 gate
2 drain
3 source
tab drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
Drain-source voltage - - 60 V
V
DGR
Drain-gate voltage R
GS
= 20 kΩ -60
±
GS
Gate-source voltage - - 15 V
±V
GSM
Non-repetitive gate-source voltage t
p
≤ 50 µs - 20 V
-60A -60B
I
D
Drain current (DC) T
mb
= 25 ˚C - 14 13 A
I
D
Drain current (DC) T
mb
= 100 ˚C - 10 9 A
I
DM
Drain current (pulse peak value) T
mb
= 25 ˚C - 56 52 A
P
tot
Total power dissipation T
mb
= 25 ˚C - 60 W
T
stg
Storage temperature - - 55 175 ˚C
T
j
Junction Temperature - - 175 ˚C
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction to - - 2.5 K/W
mounting base
R
th j-a
Thermal resistance junction to - 60 - K/W
ambient
123
tab
d
g
s
April 1993 1 Rev 1.100