Low Voltage Surface Mount
500 mW Avalanche Diodes

SCOTTSDALE DIVISION

1N5518BUR thru 1N5546BUR
(or MLL5518B thru MLL5546B)
W
W
W
.
Mi
c
r
o
s
e
m
i

.
C
O
M

1N5
518
BUR –
1N5
546
BUR



DESCRIPTION

APPEARANCE

The 1N5518BUR thru 1N5546BUR series of 0.5 watt glass surface mount
Zener voltage regulators provides a selection from 3.3 to 33 volts in standard
5% tolerances as well as tighter tolerances identified by different suffix
letters on the part number. These are also available with an internal-
metallurgical-bond option by adding a “-1” suffix (see separate data sheet)
including JAN, JANTX, and JANTXV military qualifications. Microsemi also
offers numerous other Zener products to meet higher and lower power
applications.


DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com


FEATURES

APPLICATIONS / BENEFITS
• Surface mount equivalent to JEDEC registered
1N5518 thru 1N5546 series
• Internally metallurgical bond option available by
adding “-1” suffix that also includes JAN, JANTX,
and JANTXV qualifications per MIL-PRF-19500/437
(see separate data sheet for same part numbers
with “-1” suffix
• DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration
(see separate data sheets for part numbers 1N5518
thru 1N5546 DO-7 and DO-35

• Regulates voltage over a broad operating current
and temperature range
• Extensive selection from 3.3 to 33 V
• Standard voltage tolerances are plus/minus 5% with
a “B” suffix, e.g. 1N5518BUR, etc.
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively, e.g. 1N5518CUR,
1N5518DUR, etc.
• Hermetically sealed surface mount package
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Minimal capacitance (see Figure 3)
• Inherently radiation hard as described in Microsemi
MicroNote 050


MAXIMUM RATINGS

MECHANICAL AND PACKAGING
• Operating and Storage temperature: -65
º
C to
+175
º
C
• Thermal Resistance: 150
º
C/W junction to end cap
and 300
º
C/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended footprint
(see last page)
• Steady-State Power: 0.5 watts at end cap
temperature T
EC
< 100
º
C or ambient temperature T
A
< 25
º
C when mounted on FR4 PC board as
described for thermal resistance above (see Figure
2 for derating)
• Forward voltage @200 mA: 1.1 volts (maximum)
• Solder Temperatures: 260
º
C for 10 s (max)


• CASE: Hermetically sealed glass DO-213AA
(SOD80 or MLL34) MELF style package
• TERMINALS: End caps tin-lead plated solderable
per MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
• MARKING: cathode band only
• TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 2000 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.04 grams
• See package dimensions and recommended pad
layout on last page


Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1
Copyright  2003
10-13-2003 REV A