05/2006
AWT6314R
Dual-band CDMA/PCS
3.4 V/28 dBm Linear Power Amplifier Module
PRELIMINARY DATA SHEET - Rev 1.2
M23 Package
12 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
FEATURES
• Single Mode Operation: POUT ≤ +28 dBm
• High Efficiency: 54 % AMPS, 39 % CDMA
• Low Quiescent Current: 50 mA
• 25 % Package Size Reduction
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1.1 mm
• RoHS Compliant Package, 250
o
C MSL-3
APPLICATIONS
• Dual-band Cellular/PCS CDMA Wireless
Handsets
PRODUCT DESCRIPTION
The AWT6314R meets the increasing demands for
higher levels of integration in dual-band CDMA/PCS
1X handsets, while reducing board area
requirements by 25 %. The package pinout was
chosen to enable handset manufacturers to easily
route VCC to both power amplifiers and simplify
control with a common VMODE pin. The device is
manufactured on an advanced InGaP HBT MMIC
technology offering state-of-the-art reliability,
temperature stability, and ruggedness. Selectable
bias modes that optimize efficiency for different
output power levels, and a shutdown mode with low
leakage current, serve to increase handset talk and
standby time. The self contained 3 mm x 5 mm x 1
mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50 Ω system.
Figure 1: Block Diagram
Bias Control
VREF_PCS
VMODE
RFIN_PCS
GND
VCC2 A
VCC1
1
11
9
12
103
4
2
RFOUT_PCS
VCC2
5
6
8
7
Bias Control
RFOUT_CELL
GND
VREF_CELL
RFIN_CELL
GND at slug (pad)
GND
A
W
T6314